Heatsinks & Thermal Management

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Heatsinks & Thermal Management


Shop our selection of heat sinks and thermal management components online at CPC. Find the Peltier cooler your project requires; shop for mounting kits and thermal interface materials; or browse our range of natural convection heatsinks.

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MCPE-031-10-13
MCPE-031-10-13 - Peltier Cooler, 8.8W

SC10911

Peltier Cooler, 8.8W

MULTICOMP

• PE series, max operating temperature for short term 110℃, recommended max 90℃ for long lifetime • Good reliability in ON-OFF power cycling mode • Recommended operating current 0.7 Imax for long life • Multicomp products are rated 4.6 out of 5 stars • 12...

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TV40G
TV40G - Heatsink, TO220/218, 9.9°C/W

SC10806

Heatsink, TO220/218, 9.9°C/W

BOYD

TV40G is a 22 x 38 x 28mm narrow channel-style heat sink with twisted fins. This narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices. • Thick aluminium ...

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9.9°C/W TO-218, TO-220 28mm 22mm
890SP-02000-A-100
890SP-02000-A-100 - Heatsink, 200mm

SC10900

Heatsink, 200mm

H S MARSTON

• Latest generation extrusion technology • Exceptional fin height/space ratio • Increased thermal performance from a lower mass • Optimum performance achieved when force air cooled • 0.07°C/W

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0.07°C/W - 101.6mm 32mm
MPC151525T
MPC151525T - Heatsink, Ceramic 15x15x2.5mm, Standard Tape

SC14048

Heatsink, Ceramic 15x15x2.5mm, Standard Tape

AMEC THERMASOL

The MPC151525T is a 15x15x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...

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10.21°C/W - 15mm 2.5mm
KM75-1
KM75-1 - Heatsink, TO220/218, 3.7°C/W

SC10864

Heatsink, TO220/218, 3.7°C/W

BOYD

This heatsink features a clip retaining slot and is for use with retaining clips for quick and easy fitting.

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1+ £9.40 (£11.28) 10+ £8.06 (£9.67) 100+ £6.27 (£7.52)

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3.7°C/W TO-218, TO-220 75mm 45mm
MPC101020T
MPC101020T - Heatsink, Ceramic 10x10x2mm,  Standard Tape

SC14047

Heatsink, Ceramic 10x10x2mm,  Standard Tape

AMEC THERMASOL

The MPC101020T is a 10x10x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...

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10.21°C/W - 10mm 2mm
ICK 14/16 B
ICK 14/16 B - Heatsink, DIP, Glue-On, 50°C/W

SC10788

Heatsink, DIP, Glue-On, 50°C/W

FISCHER ELEKTRONIK

• Pin count: 14/ 16

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50°C/W DIP 19mm 4.8mm
ICK 40 B
ICK 40 B - Heatsink, DIP, Glue-On, 46°C/W

SC10787

Heatsink, DIP, Glue-On, 46°C/W

FISCHER ELEKTRONIK

The ICK 40B from Fischer Elektronik is a suitable for cooling ICs in a DIl housing of 14 to 40 pins. • Pin count: 40

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8.5°C/W DIP 19mm 4.8mm
SW25-4
SW25-4 - Heatsink, TO220/218, 13°C/W

SC10841

Heatsink, TO220/218, 13°C/W

BOYD

This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. • Solderable tabs 2.6mmØ on 2...

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13°C/W TO-218, TO-220, TO-247 34.5mm 25mm
PF720
PF720 - Heatsink, TO220, 28°C/W

SC10793

Heatsink, TO220, 28°C/W

BOYD

The PF720 is a clip-on Heat Sink made of black pre-painted aluminium suitable for TO-220 packages. It is designed for use without thermal interface grease.

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28°C/W TO-220 19.7mm 20mm
ICK 14/16 L
ICK 14/16 L - Heatsink, DIP, Glue-On, 46°C/W

SC10785

Heatsink, DIP, Glue-On, 46°C/W

FISCHER ELEKTRONIK

• Pin count: 14/ 16

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46°C/W DIP 6.3mm 4.8mm
1.25GY-50
1.25GY-50 - Heatsink, TO220, 6.8°C/W

SC10807

Heatsink, TO220, 6.8°C/W

BOYD

The 1.25GY-50 from Aavid Thermalloy is a heatsink in TO220 package. • Mountable in both vertical and horizontal mode • Central groove prevents device rotation • Black anodised finish • Thermal resistance of 6.8°C/W(Horizontal) and 8.6°C/W(vertical) • Exter...

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6.8°C/W TO-220 32mm 16mm
520AB1000MB(T03)
520AB1000MB(T03) - Heatsink, TO3, 1.4°C/W

SC10873

Heatsink, TO3, 1.4°C/W

ABL HEATSINKS

The 520AB1000MB(T03) is a 100 x 88 x 35mm drilled hole Heat Sink made of aluminium with anodised finish. This heat sink features vertical mount and suitable for use with TO-3 device.

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1.4°C/W TO-3 88mm 35mm
MCTE1-19913L-S
MCTE1-19913L-S - Peltier Cooler, 200W

SC10937

Peltier Cooler, 200W

MULTICOMP

Miniature modules available for cooling components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors. • Bespoke designs available • All types of modules can be bonded using heat sink bonder • Wide variety of finishes availa...

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FK 214 SA-CB
FK 214 SA-CB - Heatsink, TO220/SOT32, 15°C/W

SC10835

Heatsink, TO220/SOT32, 15°C/W

FISCHER ELEKTRONIK

The FK 214 SA-CB is a 25.4 x 13 x 30mm finger shaped Heat Sink without solder lug. The heat sink is made of aluminium with black anodized surface. This FK 214 series heat sink is suitable for use with SOT 32 and TO 220 devices.

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15°C/W SOT-32, TO-220 25.4mm 13mm
PPL1000B
PPL1000B - Heatsink, TO220/218, 3.1°C/W

SC10883

Heatsink, TO220/218, 3.1°C/W

ABL HEATSINKS

• Serrated slot for TO-220/TO-218 screw fixing • Accepts M3 or No. 6 self tapping screw sizes

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3.1°C/W TO-218, TO-220 50mm 28mm
07WN-01500-A-200
07WN-01500-A-200 - Heatsink, Undrilled 1.5C/W

SC00637

Heatsink, Undrilled 1.5C/W

H S MARSTON

The 07WN-01500-A-200 is an extruded range-1 Heat Sink made of aluminium with black anodized finish. It is suitable for board-mounting and use with a wide variety of power devices.

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1.5°C/W - 105mm 25.4mm
520AB1250MB(TO-3X2)
520AB1250MB(TO-3X2) - Heatsink, TO3, 1.2°C/W

SC10870

Heatsink, TO3, 1.2°C/W

ABL HEATSINKS

• Aluminium heatsink • Can cool two TO-3 devices • 1.2°C/W thermal resistance • Dimension is 88mm x 35mm x 125mm (W x H x L)

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1.2°C/W TO-3 88mm 35mm
890SP-02500-A-100
890SP-02500-A-100 - Heatsink, 250mm

SC10903

Heatsink, 250mm

H S MARSTON

890SP-02500-A-100 is an ultra-fin high density cooling heat sink. • 0.05°C/W thermal resistance (performance with two papst type 3312 fans) • Aluminium heat sink material • External size (Lx H) is 250mm x 32mm • Optimum performance achieved when force air ...

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0.05°C/W - 101.6mm 32mm
FK 237 SA 220 O
FK 237 SA 220 O - Heatsink, TO220, 21°C/W

SC10853

Heatsink, TO220, 21°C/W

FISCHER ELEKTRONIK

• Small version with improved thermal resistance • Uses less PCB space than other heatsinks • Easy assembly

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21°C/W TO-220 14.5mm 12.7mm
31-35-25GFN
31-35-25GFN - Transistor Insulation Bushes, TO220, 10 Pack

SC01134

Transistor Insulation Bushes, TO220, 10 Pack

UNBRANDED

A pack of 10 T0-220 transistor insulation bushes for use with screw mounted transistors. • Designed to isolate the transformer from heatsink • Suitable for use with Sil-Pad and other thermal pads • Nylon construction • Supplied in packs of 10

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ICK SMD F 21 SA
ICK SMD F 21   SA - Heatsink, for SMD, 33°C/W

SC10780

Heatsink, for SMD, 33°C/W

FISCHER ELEKTRONIK

• Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package

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33°C/W - 8mm 6mm
374424B00035G
374424B00035G - Heatsink BGA 27 x 27 x 18 with Pad

SC10769

Heatsink BGA 27 x 27 x 18 with Pad

BOYD

• Tape mounting saves board space by eliminating mounting holes • Convenient peel and stick assembly is quick and clean • Pin-Fin array allows omni-directional airflow to maximize heat dissipation • Fin dimensions (LxW): 8x8mm

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20.3°C/W BGA 27mm 18mm
MCTE1-12712L-S
MCTE1-12712L-S - Peltier Element, Thermoelectric Cooler, 110 W, 1 ohm, 12 A, 15.4 V, 68 °C

SC10941

Peltier Element, Thermoelectric Cooler, 110 W, 1 ohm, 12 A, 15.4 V, 68 °C

MULTICOMP

Miniature modules available for cooling components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors. • Bespoke designs available • All types of modules can be bonded using heat sink bonder • Wide variety of finishes availa...

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GAP PAD 0.125" SHEET 100MMX100MM
GAP PAD 0.125

SC10740

Gap Pad, 0.125", 100mm x 100mm Sheet

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...

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