Heatsinks & Thermal Management

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Heatsinks & Thermal Management


Shop our selection of heat sinks and thermal management components online at CPC. Find the Peltier cooler your project requires; shop for mounting kits and thermal interface materials; or browse our range of natural convection heatsinks.

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Thermal Resistance Packages Cooled External Width - Metric External Height - Metric External Length - Metric External Diameter - Metric Heat Sink Material External Width - Imperial External Height - Imperial External Length - Imperial External Diameter - Imperial Product Range
 
 
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510AB0500MB(TO3)
510AB0500MB(TO3) - Heatsink, TO3, 3.3C/W

SC10799

Heatsink, TO3, 3.3C/W

ABL HEATSINKS

The 510AB0500MB(TO3) is a 50mm Heat Sink with aluminium construction, natural and black anodized finish, 3.3°C/W thermal resistance.

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3.3°C/W TO-3 65mm 20mm 50mm - Aluminium 2.56" 0.79" 1.97" - -
FK 237 SA 220 O
FK 237 SA 220 O - Heat Sink, Square, PCB, Clip On, 21 °C/W, TO-220, 14.5 mm, 12.7 mm, 19 mm

SC10853

Heat Sink, Square, PCB, Clip On, 21 °C/W, TO-220, 14.5 mm, 12.7 mm, 19 mm

FISCHER ELEKTRONIK

• Small version with improved thermal resistance • Uses less PCB space than other heatsinks • Easy assembly

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21°C/W TO-220 14.5mm 12.7mm 19mm - Aluminium 0.57" 0.5" 0.75" - -
K10-104
K10-104 - Thermal Pad, TO3P

SC10731

Thermal Pad, TO3P

BERGQUIST

Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as...

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TV1500
TV1500 - Heatsink, TO220/218, 14°C/W

SC10810

Heatsink, TO220/218, 14°C/W

BOYD

The TV1500 is a 12.7 x 30.2 x 30mm low profile channel style Heat Sink with twisted fins. This heat sink is made of aluminium with black anodized finish. This heat sink features vertical mount orientation and is suitable for use with TO-220-single gauge de...

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14.2°C/W TO-126, TO-220 30mm 12.7mm 30.2mm - Aluminium 1.18" 0.5" 1.19" - -
AKK 127
AKK 127 - Heat Sink, TO-3, 14 °C/W, TO-3, 40 mm, 12.7 mm, 27 mm

SC10830

Heat Sink, TO-3, 14 °C/W, TO-3, 40 mm, 12.7 mm, 27 mm

FISCHER ELEKTRONIK

The AKK 127 is a die-cast Heat Sink made of aluminium with black lacquered finish. It is suitable for use with transistor-design TO-3.

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14°C/W TO-3 40mm 12.7mm 27mm - Aluminium 1.57" 0.5" 1.06" - -
SW38-4
SW38-4 - Heatsink, TO220/218, 10°C/W

SC10842

Heatsink, TO220/218, 10°C/W

BOYD

• Solderable tabs 2.6mmØ on 25.4mm fixing centres

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10°C/W TO-218, TO-220, TO-247 34.5mm 38mm 12.5mm - Aluminium 1.36" 1.5" 0.49" - -
ICK SMD A 8 SA
ICK SMD A  8  SA - Heatsink, for SMD, 87°C/W

SC10771

Heatsink, for SMD, 87°C/W

FISCHER ELEKTRONIK

• Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package

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87°C/W DIP-8, SSOP-20, SSOP-24, SSOP-28, TSSOP-24, TSSOP-28, TSSOP-38 6.3mm 4.8mm 8mm - Aluminium 0.25" 0.19" 0.31" - -
374024B00032G
374024B00032G - Heatsink BGA 23 x 23 x 10 with Pad

SC10762

Heatsink BGA 23 x 23 x 10 with Pad

BOYD

• Tape mounting saves board space by eliminating mounting holes • Convenient peel and stick assembly is quick and clean • Pin-Fin array allows omni-directional airflow to maximize heat dissipation • Fin dimensions (LxW): 11x10mm

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40°C/W BGA 23mm 10mm 23mm - Aluminium 0.91" 0.39" 0.91" - -
FK 224 SA 220-1
FK 224 SA 220-1 - Heatsink, TO220

SC10832

Heatsink, TO220

FISCHER ELEKTRONIK

The FK 224 SA 220-1 is a 25 x 8.3 x 29.4mm attachable Heat Sink with solder lug for vertical installation. This heat sink is made of aluminium with black anodized solderable surface. This FK 224 series heat sink is suitable for use with TO 218 and TO 220 d...

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18°C/W TO-220 25mm 8.3mm 29.4mm - Aluminium 0.98" 0.33" 1.16" - -
SW50-4
SW50-4 - Heatsink, TO220/218, 8.6°C/W

SC10851

Heatsink, TO220/218, 8.6°C/W

BOYD

• Solderable tabs 2.6mmØ on 25.4mm fixing centres

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8.6°C/W TO-218, TO-220, TO-247 34.5mm 50mm 12.5mm - Aluminium 1.36" 1.97" 0.49" - -
ICK SMD F 21 SA
ICK SMD F 21   SA - Heatsink, for SMD, 33°C/W

SC10780

Heatsink, for SMD, 33°C/W

FISCHER ELEKTRONIK

• Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package

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33°C/W - 8mm 6mm 21mm - Aluminium 0.31" 0.24" 0.83" - -
FK 222 MI 220
FK 222 MI 220 - Heat Sink, TO-220, 20 °C/W, TO-220, 25.4 mm, 12.7 mm, 33.8 mm

SC10831

Heat Sink, TO-220, 20 °C/W, TO-220, 25.4 mm, 12.7 mm, 33.8 mm

FISCHER ELEKTRONIK

• Solderable surface

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20°C/W TO-220 25.4mm 12.7mm 33.8mm - Aluminium 1" 0.5" 1.33" - -
3223-07FR-104NH
3223-07FR-104NH - Thermal Pad, TO3P

SC10729

Thermal Pad, TO3P

BERGQUIST

• Suitable for TO-3P packages • Clean, grease-free and flexible • 0.45°C/W thermal resistance • Electrically isolating to 3.5kV (min) • Silicon rubber/fibreglass • -60℃ to +180℃ operating temperature • 0.18mm thickness

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- - - - - - - - - - - -
MCPE1-12707AC-S
MCPE1-12707AC-S - Peltier Cooler, 55.6W

SC10938

Peltier Cooler, 55.6W

MULTICOMP PRO

Miniature modules available for cooling components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors. • Bespoke designs available • All types of modules can be bonded using heat sink bonder • Wide variety of finishes availa...

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- - - - - - - - - - - MCPE
5F
5F - Heatsink, TO5, 48°C/W

SC10803

Heatsink, TO5, 48°C/W

BOYD

The 5F is a 12.7mm board level Heat Sink made of aluminium, mounted by self-tapping screw in flank. This PCB mount heat sink is suitable for use with TO-5 device.

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45.2°C/W TO-5 - 12.7mm - 14.3mm Aluminium - 0.5" - 0.63" -
HF35G
HF35G - Heatsink, TO220, 11°C/W

SC10796

Heatsink, TO220, 11°C/W

BOYD

The HF35G is a 27.94 x 20 x 36mm versatile and powerful extruded Heat Sink with integral spring clip and solderable tabs. This heat sink is made of aluminium with black anodize finish and features vertical mount orientation. The incorporated tinned wire le...

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11°C/W TO-220 36mm 28mm 20mm - Aluminium 1.42" 1.1" 0.79" - -
ICK SMD A 22 SA
ICK SMD A 22  SA - Heatsink, for SMD, 34°C/W

SC10779

Heatsink, for SMD, 34°C/W

FISCHER ELEKTRONIK

• Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package

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34°C/W - 6.3mm 4.8mm 22mm - Aluminium 0.25" 0.19" 0.87" - -
637-10ABPE
637-10ABPE - Heatsink, TO220, 5°C/W

SC10904

Heatsink, TO220, 5°C/W

WAKEFIELD THERMAL

The 637-10ABPE is a 12.7mm high-efficiency board level power semiconductor Heat Sink with aluminium, black anodized, 12.67°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting on printed circuit board...

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5.8°C/W TO-220 34.9mm 25.4mm 12.7mm - Aluminium 1.37" 1" 0.5" - -
FK 242 SA 220 O
FK 242 SA 220 O - Heat Sink, TO-220, 26 °C/W, TO-220, 14.5 mm, 15.24 mm, 12.7 mm

SC10855

Heat Sink, TO-220, 26 °C/W, TO-220, 14.5 mm, 15.24 mm, 12.7 mm

FISCHER ELEKTRONIK

• Small version with improved thermal resistance • Uses less PCB space than other heatsinks • Easy assembly

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26°C/W TO-220 14.5mm 15.24mm 12.7mm - Aluminium 0.57" 0.6" 0.5" - -
T62-150-025-100G
T62-150-025-100G - Graphite Pad, 0.25mm

SC10708

Graphite Pad, 0.25mm

T GLOBAL

The T62-150-025-100G is a 0.25 x 150mm Graphite Pad with high thermal conductivity graphite material for interface between metal to metal contacts and for heat sinking and high electrical conductivity provides benefit in EMI properties. This thermally cond...

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- - - - - - - - - - - T62
523002B00000G
523002B00000G - Heatsink, TO220, 19°C/W

SC10809

Heatsink, TO220, 19°C/W

BOYD

The 523002B00000G is a channel Heat Sink with integrated tabs suitable for TO-220 and single-gauge (0.02-inch) TO-220 packages. This 6230B heat sink is made of aluminium with black anodize finish. • Vertical mount orientation

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19°C/W TO-220 25.4mm 12.7mm 30mm - Aluminium 1" 0.5" 1.18" - -
L373S-150-1.0
L373S-150-1.0 - Gap Filler, 1X150mm Sq

SC10717

Gap Filler, 1X150mm Sq

T GLOBAL

• Soft material highly compressible, easy to assemble, and provide good electrical insulation • Shock and vibration absorber • Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction • Dissipates heat from LEDs, mo...

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- - - - - - - - - - - L373S
MQ75-1
MQ75-1 - Heatsink, 7.5°C/W

SC12547

Heatsink, 7.5°C/W

BOYD

The MQ75-1 is a 75 x 29.5 x 11mm undrilled power Heat Sink made of aluminium with black anodized finish. This heat sink is suitable for use with TO-218 and TO-220 devices.

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7.5°C/W TO-218, TO-220 29.5mm 11mm 75mm - Aluminium 1.16" 0.43" 2.95" - -
ICK SMD A 10 SA
ICK SMD A 10  SA - Heatsink, for SMD, 75°C/W

SC10772

Heatsink, for SMD, 75°C/W

FISCHER ELEKTRONIK

• Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package

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75°C/W SOIC-16, SOIC-18 6.3mm 4.8mm 10mm - Aluminium 0.25" 0.19" 0.39" - -
374424B00035G
374424B00035G - Heatsink BGA 27 x 27 x 18 with Pad

SC10769

Heatsink BGA 27 x 27 x 18 with Pad

BOYD

• Tape mounting saves board space by eliminating mounting holes • Convenient peel and stick assembly is quick and clean • Pin-Fin array allows omni-directional airflow to maximize heat dissipation • Fin dimensions (LxW): 8x8mm

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20.3°C/W BGA 27mm 18mm 27mm - Aluminium 1.06" 0.71" 1.06" - -