Heatsinks & Thermal Management

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Heatsinks & Thermal Management


Shop our selection of heat sinks and thermal management components online at CPC. Find the Peltier cooler your project requires; shop for mounting kits and thermal interface materials; or browse our range of natural convection heatsinks.

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Insulator Body Material Thermal Conductivity Breakdown Voltage Vbr Thickness Thermal Impedance Dielectric Strength Product Range
 
 
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K10-54
K10-54 - Thermal Pad, TO220

SC10730

Thermal Pad, TO220

BERGQUIST

Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as...

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PI (Polyimide) Film 1.3W/m.K 6kV 0.152mm 0.86°C/W - -
345AB1000B
345AB1000B - Heat Sink, 1 °C/W, 120 mm, 37 mm, 100 mm

SC01141

Heat Sink, 1 °C/W, 120 mm, 37 mm, 100 mm

ABL HEATSINKS

The 345AB1000B is a 100mm extruded Heat Sink with aluminium construction, natural and black anodized finish, 1°C/W thermal resistance.

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BG405792
BG405792 - Gap Pad, Thermally Conductive Interface, Sheet, 0.8 W/m.K, 1.52  mm Thickness

SC10734

Gap Pad, Thermally Conductive Interface, Sheet, 0.8 W/m.K, 1.52 mm Thickness

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This sheet is ideal for low stress applications and fragile components. • Eliminates...

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- 0.8W/m.K - 1.52mm - - -
510AB0500MB(TO3)
510AB0500MB(TO3) - Heatsink, TO3, 3.3C/W

SC10799

Heatsink, TO3, 3.3C/W

ABL HEATSINKS

The 510AB0500MB(TO3) is a 50mm Heat Sink with aluminium construction, natural and black anodized finish, 3.3°C/W thermal resistance.

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FK 212 SA-CB
FK 212 SA-CB - Heat Sink, TO-220/SOT-32, 18 °C/W, SOT-32, TO-220, 25.4 mm, 8 mm, 30 mm

SC10839

Heat Sink, TO-220/SOT-32, 18 °C/W, SOT-32, TO-220, 25.4 mm, 8 mm, 30 mm

FISCHER ELEKTRONIK

The FK 212 SA-CB is a finger-shaped Heat Sink made of aluminium with black anodised finish. It is suitable for use with SOT-32 and TO-220 transistors. The naming finger-shaped is caused by its form which reminds to a hand with opened or spread fingers.

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HF20
HF20 - Heat Sink, TO-220, 13 °C/W, TO-220, 21 mm, 28 mm, 20 mm

SC10794

Heat Sink, TO-220, 13 °C/W, TO-220, 21 mm, 28 mm, 20 mm

BOYD

The HF20 is a 27.94 x 20 x 21mm versatile and powerful extruded Heat Sink with integral spring clip and solderable tabs. This heat sink is made of aluminium with black anodize finish and features vertical mount orientation. The incorporated tinned wire lea...

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150AB1500MB
150AB1500MB - Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 150 mm

SC10892

Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 150 mm

ABL HEATSINKS

The 150AB1500MB is a T-slots Heat Sink made of aluminium.

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BP100-0.005-00-6/6
BP100-0.005-00-6/6 - Thermal Insulator, Bond-Ply 100, .005

SC10753

Thermal Insulator, Bond-Ply 100, .005", 6" x 6" Sheet, Carbon, 0.8 W/m.K, 3 kV, 0.127 mm

BERGQUIST

• Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB • Thermal impedance: 0.86℃ - in²/W (@ 100 psi) • High bond strength to a variety of surfaces • Double-sided pressure sensitive adhesive tape • High performance, ...

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Carbon 0.8W/m.K 3kV 0.127mm - - -
374324B60023G
374324B60023G - Heatsink BGA 27 x 27 x 10 with Clip

SC10766

Heatsink BGA 27 x 27 x 10 with Clip

BOYD

• Solder anchors provide the most rugged mounting in the industry • Simple tool-free installation • Minimal PC Board real estate is required for mounting • Clip design allows for easy removal in case of rework • Clip design compatible with solder anchors ...

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ICK SMD F 21 SA
ICK SMD F 21   SA - Heat Sink, For SMD, 33 °C/W, 8 mm, 6 mm, 21 mm

SC10780

Heat Sink, For SMD, 33 °C/W, 8 mm, 6 mm, 21 mm

FISCHER ELEKTRONIK

• Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package

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GAP PAD 0.125" SHEET 100MMX100MM
GAP PAD 0.125

SC10740

Gap Pad, 0.125", 100mm x 100mm Sheet

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...

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- 0.8W/m.K - 3.175mm - - -
3223-07FR-43
3223-07FR-43 - Thermal Pad, Silicone, Fibreglass, 0.178 mm, 0.9 W/m.K

SC10727

Thermal Pad, Silicone, Fibreglass, 0.178 mm, 0.9 W/m.K

BERGQUIST

The 3223-07FR-43 from Bergquist is a fibreglass based silicone pad. • Suitable for clip mounted TO-220 packages, or screw mounted TO-220 • Clean, grease-free and flexible • 0.45°C/W thermal resistance • Electrically isolating to 3.5kV (min) • Silicon rubbe...

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- 0.9W/m.K - 0.178mm - - -
L373S-150-1.5
L373S-150-1.5 - Gap Filler, 1.5mm Sheet

SC10718

Gap Filler, 1.5mm Sheet

T GLOBAL

• Soft material highly compressible, easy to assemble, and provide good electrical insulation • Shock and vibration absorber • Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction • Dissipates heat from LEDs, mo...

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- 1.6W/m.K - 1.5mm - - L373S
3-38-32GFN
3-38-32GFN - TRANS. INSULATION BUSHES, T03P, 10PK

SC01135

TRANS. INSULATION BUSHES, T03P, 10PK

UNBRANDED

• For use with screw mounted transistors • Designed to isolate the transformer from heatsink • T0-3P size • Suitable for use with Sil-Pad and other thermal pads • Nylon construction • Supplied in packs of 10

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1+ £0.66 (£0.79) 10+ £0.64 (£0.77) 100+ £0.54 (£0.65) 250+ £0.51 (£0.61)

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FK 213 SA-32
FK 213 SA-32 - Heat Sink, SOT-32/TO-126, 21 °C/W, SOT-32, TO-220, 25.4 mm, 13 mm, 18 mm

SC10833

Heat Sink, SOT-32/TO-126, 21 °C/W, SOT-32, TO-220, 25.4 mm, 13 mm, 18 mm

FISCHER ELEKTRONIK

The FK 213 SA-32 is a 25.4 x 13 x 18mm finger shaped Heat Sink without solder lug. The heat sink is made of aluminium with black anodized surface. This FK 213 series heat sink is suitable for use with SOT 32 device.

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150AB1000MB
150AB1000MB - Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 100 mm

SC10891

Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 100 mm

ABL HEATSINKS

The 150AB1000MB is a 100 x 96 x 40mm undrilled Heat Sink made of aluminium with tee-slots.

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PPN0500B
PPN0500B - Heat Sink, TO-218, TO-220, 5 °C/W, TO-218, TO-220, 50 mm, 28 mm, 50 mm

SC10875

Heat Sink, TO-218, TO-220, 5 °C/W, TO-218, TO-220, 50 mm, 28 mm, 50 mm

ABL HEATSINKS

A simple, reliable and convenient alternative to screw attachment. The heatsinks also include slots to allow the option of screw connections.

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6400BG
6400BG - Heat Sink, TO-220/218, 2.7 °C/W, TO-218, TO-220, TO-247, 41.91 mm, 63.5 mm, 25.4 mm

SC12544

Heat Sink, TO-220/218, 2.7 °C/W, TO-218, TO-220, TO-247, 41.91 mm, 63.5 mm, 25.4 mm

BOYD

High power extruded heat sink with large radial fins and straight pins. • Radial fins • Quality Extruded design • PCB Pins for secure mounting

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K10-104
K10-104 - Thermal Pad, TO3P

SC10731

Thermal Pad, TO3P

BERGQUIST

Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as...

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PI (Polyimide) Film 1.3W/m.K 6kV 0.152mm 0.86°C/W - -
TV1500
TV1500 - Heat Sink, Square, PCB, Twisted Fin, 14.2 °C/W, TO-126, TO-220, 30 mm, 12.7 mm, 30.2 mm

SC10810

Heat Sink, Square, PCB, Twisted Fin, 14.2 °C/W, TO-126, TO-220, 30 mm, 12.7 mm, 30.2 mm

BOYD

The TV1500 is a 12.7 x 30.2 x 30mm low profile channel style Heat Sink with twisted fins. This heat sink is made of aluminium with black anodized finish. This heat sink features vertical mount orientation and is suitable for use with TO-220-single gauge de...

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T62-150-025-100G
T62-150-025-100G - Graphite Sheet, 20 W/m.K, Graphite Sheet, 0.25 mm, 150 mm

SC10708

Graphite Sheet, 20 W/m.K, Graphite Sheet, 0.25 mm, 150 mm

T GLOBAL

The T62-150-025-100G is a 0.25 x 150mm Graphite Pad with high thermal conductivity graphite material for interface between metal to metal contacts and for heat sinking and high electrical conductivity provides benefit in EMI properties. This thermally cond...

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- 20W/m.K - 0.25mm - - T62
325AB1500B
325AB1500B - Heat Sink, 2.2 °C/W, 93 mm, 14 mm, 150 mm

SC10886

Heat Sink, 2.2 °C/W, 93 mm, 14 mm, 150 mm

ABL HEATSINKS

The 325AB1500B is a 150 x 93 x 14mm undrilled Heat Sink made of aluminium with anodised finish. This heat sink features vertical mount.

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ICK SMD B 10 SA
ICK SMD B 10  SA - Heatsink, for SMD, 35°C/W

SC10784

Heatsink, for SMD, 35°C/W

FISCHER ELEKTRONIK

• Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package

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BG405793
BG405793 - Thermal Gap Pad, VO Soft, 0.125

SC10741

Thermal Gap Pad, VO Soft, 0.125", Sheet

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This sheet is ideal for low stress applications and fragile components. • Eliminates...

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- 0.8W/m.K - 3.2mm - - -
L373S-150-1.0
L373S-150-1.0 - Gap Filler, 1X150mm Sq

SC10717

Gap Filler, 1X150mm Sq

T GLOBAL

• Soft material highly compressible, easy to assemble, and provide good electrical insulation • Shock and vibration absorber • Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction • Dissipates heat from LEDs, mo...

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- 1.6W/m.K - 1mm - - L373S