Heatsinks & Thermal Management
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Heatsinks & Thermal Management
Shop our selection of heat sinks and thermal management components online at CPC. Find the Peltier cooler your project requires; shop for mounting kits and thermal interface materials; or browse our range of natural convection heatsinks.
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Manufacturer Part No | Order Code | Description / Manufacturer | Availability | Price For |
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Quantity | Thermal Resistance | Packages Cooled | External Width - Metric | External Height - Metric | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Sort Acending Sort Decending | Sort Acending Sort Decending | Sort Acending Sort Decending | Sort Acending Sort Decending | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
AKK 127
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SC10830 |
Heatsink, TO3, 14°C/W FISCHER ELEKTRONIK The AKK 127 is a die-cast Heat Sink made of aluminium with black lacquered finish. It is suitable for use with transistor-design TO-3.
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14°C/W | TO-3 | 40mm | 12.7mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SW38-4
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SC10842 |
Heatsink, TO220/218, 10°C/W BOYD • Solderable tabs 2.6mmØ on 25.4mm fixing centres
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10°C/W | TO-218, TO-220, TO-247 | 34.5mm | 38mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ICK SMD A 8 SA
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SC10771 |
Heatsink, for SMD, 87°C/W FISCHER ELEKTRONIK • Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package
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1+ £0.43 (£0.52) 10+ £0.37 (£0.44) 25+ £0.32 (£0.38) |
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87°C/W | DIP-8, SSOP-20, SSOP-24, SSOP-28, TSSOP-24, TSSOP-28, TSSOP-38 | 6.3mm | 4.8mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
374024B00032G
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SC10762 |
Heatsink BGA 23 x 23 x 10 with Pad BOYD • Tape mounting saves board space by eliminating mounting holes • Convenient peel and stick assembly is quick and clean • Pin-Fin array allows omni-directional airflow to maximize heat dissipation • Fin dimensions (LxW): 11x10mm
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40°C/W | BGA | 23mm | 10mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
FK 224 SA 220-1
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SC10832 |
Heatsink, TO220 FISCHER ELEKTRONIK The FK 224 SA 220-1 is a 25 x 8.3 x 29.4mm attachable Heat Sink with solder lug for vertical installation. This heat sink is made of aluminium with black anodized solderable surface. This FK 224 series heat sink is suitable for use with TO 218 and TO 220 d...
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18°C/W | TO-220 | 25mm | 8.3mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SW50-4
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SC10851 |
Heatsink, TO220/218, 8.6°C/W BOYD • Solderable tabs 2.6mmØ on 25.4mm fixing centres
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8.6°C/W | TO-218, TO-220, TO-247 | 34.5mm | 50mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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ICK SMD F 21 SA
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SC10780 |
Heatsink, for SMD, 33°C/W FISCHER ELEKTRONIK • Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package
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33°C/W | - | 8mm | 6mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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FK 222 MI 220
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SC10831 |
Heatsink, TO220, 20°C/W FISCHER ELEKTRONIK • Solderable surface
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1+ £1.09 (£1.31) 100+ £0.84 (£1.01) 250+ £0.70 (£0.84) |
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20°C/W | TO-220 | 25.4mm | 12.7mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3223-07FR-104NH
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SC10729 |
Thermal Pad, TO3P BERGQUIST • Suitable for TO-3P packages • Clean, grease-free and flexible • 0.45°C/W thermal resistance • Electrically isolating to 3.5kV (min) • Silicon rubber/fibreglass • -60℃ to +180℃ operating temperature • 0.18mm thickness
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MCPE1-12707AC-S
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SC10938 |
Peltier Cooler, 55.6W MULTICOMP Miniature modules available for cooling components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors. • Bespoke designs available • All types of modules can be bonded using heat sink bonder • Wide variety of finishes availa...
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1+ £19.17 (£23.00) 10+ £15.79 (£18.95) 25+ £13.53 (£16.24) 100+ £12.07 (£14.48) |
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5F
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SC10803 |
Heatsink, TO5, 48°C/W BOYD The 5F is a 12.7mm board level Heat Sink made of aluminium, mounted by self-tapping screw in flank. This PCB mount heat sink is suitable for use with TO-5 device.
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45.2°C/W | TO-5 | - | 12.7mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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HF35G
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SC10796 |
Heatsink, TO220, 11°C/W BOYD The HF35G is a 27.94 x 20 x 36mm versatile and powerful extruded Heat Sink with integral spring clip and solderable tabs. This heat sink is made of aluminium with black anodize finish and features vertical mount orientation. The incorporated tinned wire le...
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11°C/W | TO-220 | 36mm | 28mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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ICK SMD A 22 SA
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SC10779 |
Heatsink, for SMD, 34°C/W FISCHER ELEKTRONIK • Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package
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34°C/W | - | 6.3mm | 4.8mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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637-10ABPE
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SC10904 |
Heatsink, TO220, 5°C/W WAKEFIELD THERMAL The 637-10ABPE is a 12.7mm high-efficiency board level power semiconductor Heat Sink with aluminium, black anodized, 12.67°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting on printed circuit board...
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5.8°C/W | TO-220 | 34.9mm | 25.4mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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FK 242 SA 220 O
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SC10855 |
Heatsink, TO220, 26°C/W FISCHER ELEKTRONIK • Small version with improved thermal resistance • Uses less PCB space than other heatsinks • Easy assembly
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26°C/W | TO-220 | 14.5mm | 15.24mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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350AB1500B
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SC01164 |
Heatsink, 0.5C/W ABL HEATSINKS The 350AB1500B is a 150mm extruded Heat Sink with aluminium, natural and black anodized, 0.74°C/W thermal resistance.
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0.74°C/W | - | 125mm | 50mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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T62-150-025-100G
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SC10708 |
Graphite Pad, 0.25mm T GLOBAL The T62-150-025-100G is a 0.25 x 150mm Graphite Pad with high thermal conductivity graphite material for interface between metal to metal contacts and for heat sinking and high electrical conductivity provides benefit in EMI properties. This thermally cond...
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- | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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523002B00000G
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SC10809 |
Heatsink, TO220, 19°C/W BOYD The 523002B00000G is a channel Heat Sink with integrated tabs suitable for TO-220 and single-gauge (0.02-inch) TO-220 packages. This 6230B heat sink is made of aluminium with black anodize finish. • Vertical mount orientation
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19°C/W | TO-220 | 25.4mm | 12.7mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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L373S-150-1.0
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SC10717 |
Gap Filler, 1X150mm Sq T GLOBAL • Soft material highly compressible, easy to assemble, and provide good electrical insulation • Shock and vibration absorber • Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction • Dissipates heat from LEDs, mo...
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- | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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ICK SMD A 10 SA
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SC10772 |
Heatsink, for SMD, 75°C/W FISCHER ELEKTRONIK • Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package
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75°C/W | SOIC-16, SOIC-18 | 6.3mm | 4.8mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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436966
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SC00670 |
Heatsink, TO220/218 3.3C/W BOYD • Thermal Resistance : 3.3°C/W • Packages Cooled : TO-218, TO-220 • External Width - Metric : 41.91mm • External Height - Metric : 25.4mm
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3.3°C/W | TO-218, TO-220 | 41.91mm | 25.4mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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374424B00035G
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SC10769 |
Heatsink BGA 27 x 27 x 18 with Pad BOYD • Tape mounting saves board space by eliminating mounting holes • Convenient peel and stick assembly is quick and clean • Pin-Fin array allows omni-directional airflow to maximize heat dissipation • Fin dimensions (LxW): 8x8mm
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20.3°C/W | BGA | 27mm | 18mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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150AB2000B
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SC10895 |
Heatsink, T Slots, 0.87°C/W ABL HEATSINKS The 150AB2000B is a T-slots Heat Sink made of aluminium.
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0.87°C/W | - | 96mm | 40mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SW38-2G
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SC10844 |
Heatsink, TO220/218, 10°C/W BOYD • Solderable tabs 2.6mmØ on 25.4mm fixing centres
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10°C/W | TO-218, TO-220, TO-247 | 34.5mm | 38mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PF436G
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SC10792 |
Heatsink, TO220, 25°C/W BOYD The PF436G is a 19.5 x 12.7 x 13mm plug-in style Heat Sink with solderable tab offset from centre. This heat sink is made of aluminium with pre-black anodized finish. This board level heat sink features horizontal mount orientation and suitable for use wit...
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25°C/W | TO-220 | 12.7mm | 13mm |