Heatsinks & Thermal Management
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Heatsinks & Thermal Management
Shop our selection of heat sinks and thermal management components online at CPC. Find the Peltier cooler your project requires; shop for mounting kits and thermal interface materials; or browse our range of natural convection heatsinks.
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| Manufacturer Part No | Order Code | Description / Manufacturer | Availability | Price For |
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Quantity | Insulator Body Material | Thermal Conductivity | Breakdown Voltage Vbr | Thickness | Thermal Impedance | Dielectric Strength | Product Range | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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K10-54
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SC10730 |
Thermal Pad, TO220 BERGQUIST Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as...
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PI (Polyimide) Film | 1.3W/m.K | 6kV | 0.152mm | 0.86°C/W | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
345AB1000B
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SC01141 |
Heat Sink, 1 °C/W, 120 mm, 37 mm, 100 mm ABL HEATSINKS The 345AB1000B is a 100mm extruded Heat Sink with aluminium construction, natural and black anodized finish, 1°C/W thermal resistance.
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BG405792
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SC10734 |
Gap Pad, Thermally Conductive Interface, Sheet, 0.8 W/m.K, 1.52 mm Thickness BERGQUIST Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This sheet is ideal for low stress applications and fragile components. • Eliminates...
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- | 0.8W/m.K | - | 1.52mm | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
510AB0500MB(TO3)
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SC10799 |
Heatsink, TO3, 3.3C/W ABL HEATSINKS The 510AB0500MB(TO3) is a 50mm Heat Sink with aluminium construction, natural and black anodized finish, 3.3°C/W thermal resistance.
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FK 212 SA-CB
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SC10839 |
Heat Sink, TO-220/SOT-32, 18 °C/W, SOT-32, TO-220, 25.4 mm, 8 mm, 30 mm FISCHER ELEKTRONIK The FK 212 SA-CB is a finger-shaped Heat Sink made of aluminium with black anodised finish. It is suitable for use with SOT-32 and TO-220 transistors. The naming finger-shaped is caused by its form which reminds to a hand with opened or spread fingers.
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HF20
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SC10794 |
Heat Sink, TO-220, 13 °C/W, TO-220, 21 mm, 28 mm, 20 mm BOYD The HF20 is a 27.94 x 20 x 21mm versatile and powerful extruded Heat Sink with integral spring clip and solderable tabs. This heat sink is made of aluminium with black anodize finish and features vertical mount orientation. The incorporated tinned wire lea...
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150AB1500MB
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SC10892 |
Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 150 mm ABL HEATSINKS The 150AB1500MB is a T-slots Heat Sink made of aluminium.
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BP100-0.005-00-6/6
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SC10753 |
Thermal Insulator, Bond-Ply 100, .005", 6" x 6" Sheet, Carbon, 0.8 W/m.K, 3 kV, 0.127 mm BERGQUIST • Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB • Thermal impedance: 0.86℃ - in²/W (@ 100 psi) • High bond strength to a variety of surfaces • Double-sided pressure sensitive adhesive tape • High performance, ...
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Carbon | 0.8W/m.K | 3kV | 0.127mm | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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374324B60023G
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SC10766 |
Heatsink BGA 27 x 27 x 10 with Clip BOYD • Solder anchors provide the most rugged mounting in the industry • Simple tool-free installation • Minimal PC Board real estate is required for mounting • Clip design allows for easy removal in case of rework • Clip design compatible with solder anchors ...
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ICK SMD F 21 SA
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SC10780 |
Heat Sink, For SMD, 33 °C/W, 8 mm, 6 mm, 21 mm FISCHER ELEKTRONIK • Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package
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GAP PAD 0.125" SHEET 100MMX100MM
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SC10740 |
Gap Pad, 0.125", 100mm x 100mm Sheet BERGQUIST Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...
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- | 0.8W/m.K | - | 3.175mm | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3223-07FR-43
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SC10727 |
Thermal Pad, Silicone, Fibreglass, 0.178 mm, 0.9 W/m.K BERGQUIST The 3223-07FR-43 from Bergquist is a fibreglass based silicone pad. • Suitable for clip mounted TO-220 packages, or screw mounted TO-220 • Clean, grease-free and flexible • 0.45°C/W thermal resistance • Electrically isolating to 3.5kV (min) • Silicon rubbe...
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- | 0.9W/m.K | - | 0.178mm | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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L373S-150-1.5
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SC10718 |
Gap Filler, 1.5mm Sheet T GLOBAL • Soft material highly compressible, easy to assemble, and provide good electrical insulation • Shock and vibration absorber • Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction • Dissipates heat from LEDs, mo...
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- | 1.6W/m.K | - | 1.5mm | - | - | L373S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-38-32GFN
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SC01135 |
TRANS. INSULATION BUSHES, T03P, 10PK UNBRANDED • For use with screw mounted transistors • Designed to isolate the transformer from heatsink • T0-3P size • Suitable for use with Sil-Pad and other thermal pads • Nylon construction • Supplied in packs of 10
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Pack of 10
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FK 213 SA-32
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SC10833 |
Heat Sink, SOT-32/TO-126, 21 °C/W, SOT-32, TO-220, 25.4 mm, 13 mm, 18 mm FISCHER ELEKTRONIK The FK 213 SA-32 is a 25.4 x 13 x 18mm finger shaped Heat Sink without solder lug. The heat sink is made of aluminium with black anodized surface. This FK 213 series heat sink is suitable for use with SOT 32 device.
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150AB1000MB
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SC10891 |
Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 100 mm ABL HEATSINKS The 150AB1000MB is a 100 x 96 x 40mm undrilled Heat Sink made of aluminium with tee-slots.
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PPN0500B
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SC10875 |
Heat Sink, TO-218, TO-220, 5 °C/W, TO-218, TO-220, 50 mm, 28 mm, 50 mm ABL HEATSINKS A simple, reliable and convenient alternative to screw attachment. The heatsinks also include slots to allow the option of screw connections.
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6400BG
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SC12544 |
Heat Sink, TO-220/218, 2.7 °C/W, TO-218, TO-220, TO-247, 41.91 mm, 63.5 mm, 25.4 mm BOYD High power extruded heat sink with large radial fins and straight pins. • Radial fins • Quality Extruded design • PCB Pins for secure mounting
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K10-104
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SC10731 |
Thermal Pad, TO3P BERGQUIST Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as...
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PI (Polyimide) Film | 1.3W/m.K | 6kV | 0.152mm | 0.86°C/W | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TV1500
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SC10810 |
Heat Sink, Square, PCB, Twisted Fin, 14.2 °C/W, TO-126, TO-220, 30 mm, 12.7 mm, 30.2 mm BOYD The TV1500 is a 12.7 x 30.2 x 30mm low profile channel style Heat Sink with twisted fins. This heat sink is made of aluminium with black anodized finish. This heat sink features vertical mount orientation and is suitable for use with TO-220-single gauge de...
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T62-150-025-100G
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SC10708 |
Graphite Sheet, 20 W/m.K, Graphite Sheet, 0.25 mm, 150 mm T GLOBAL The T62-150-025-100G is a 0.25 x 150mm Graphite Pad with high thermal conductivity graphite material for interface between metal to metal contacts and for heat sinking and high electrical conductivity provides benefit in EMI properties. This thermally cond...
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- | 20W/m.K | - | 0.25mm | - | - | T62 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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325AB1500B
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SC10886 |
Heat Sink, 2.2 °C/W, 93 mm, 14 mm, 150 mm ABL HEATSINKS The 325AB1500B is a 150 x 93 x 14mm undrilled Heat Sink made of aluminium with anodised finish. This heat sink features vertical mount.
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ICK SMD B 10 SA
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SC10784 |
Heatsink, for SMD, 35°C/W FISCHER ELEKTRONIK • Heatsink especially for SMD packages • Low size • Reduced weight • Effective heat transmission • Bonding directly on IC package
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BG405793
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SC10741 |
Thermal Gap Pad, VO Soft, 0.125", Sheet BERGQUIST Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This sheet is ideal for low stress applications and fragile components. • Eliminates...
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- | 0.8W/m.K | - | 3.2mm | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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L373S-150-1.0
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SC10717 |
Gap Filler, 1X150mm Sq T GLOBAL • Soft material highly compressible, easy to assemble, and provide good electrical insulation • Shock and vibration absorber • Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction • Dissipates heat from LEDs, mo...
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- | 1.6W/m.K | - | 1mm | - | - | L373S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||



























