Thermally Conductive Adhesives
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Thermally Conductive Adhesives
Displaying products for Thermally Conductive Adhesives - from our range of leading brand manufacturers.
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Manufacturer Part No | Order Code | Description / Manufacturer | Availability | Price For |
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Quantity | Adhesive Type | Adhesive Colour | Thermal Conductivity | Tensile Strength | Dispensing Method | Volume | Weight | Product Range | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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WLK 5
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SC10757 |
Adhesive, Thermal Conductive, 5g FISCHER ELEKTRONIK Epoxy based 2 component adhesive. The main characteristics are its good heat conductivity, high dielectric strength, and an expansion coefficient suited to copper and aluminium. The thermally conductive adhesive binds porous and non-porous surfaces such as...
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1+ £15.91 (£19.09) 5+ £14.01 (£16.81) 10+ £12.79 (£15.35) |
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Activator / Hardener | - | 0.822W/m.K | - | - | - | 5g | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC002571
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SA03679 |
Epoxy Resin, Black 1kg MULTICOMP PRO This is a two-part, general purpose epoxy resin formulated for potting and encapsulation of electronics. The cured resin system meets the UL94 V-0 flammability rating. The flame retardant technology leads to low toxicity fumes and low smoke emission. It co...
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1+ £23.22 (£27.86) 10+ £21.89 (£26.27) |
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- | - | - | - | Packet | - | 1kg | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC002569
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SA03675 |
Epoxy Resin, Black 50g MULTICOMP PRO • Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack
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1+ £8.10 (£9.72) 10+ £7.41 (£8.89) |
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- | - | - | - | Packet | - | 50g | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC002568
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SA03678 |
Epoxy Resin, Black 500g MULTICOMP • Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack
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- | - | - | - | Packet | - | 500g | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC002566
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SA03676 |
Epoxy Resin, Black 100g MULTICOMP • Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack
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- | - | - | - | Packet | - | 100g | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MC002567
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SA03677 |
Epoxy Resin, Black 250g MULTICOMP • Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack
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- | - | - | - | Packet | - | 250g | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MPC151525T
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SC14048 |
Heatsink, Ceramic 15x15x2.5mm, Standard Tape AMEC THERMASOL The MPC151525T is a 15x15x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...
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1+ £1.15 (£1.38) 10+ £0.94 (£1.13) 100+ £0.72 (£0.86) 250+ £0.62 (£0.74) |
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- | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LI-98-150-025
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SC10691 |
Thermal Tape, Adhesive, 150mm x 150mm T GLOBAL A sheet of double sided adhesive designed for use with thermal gap fillers. • Good adhesion • Very good thermal conductivity • Highly compressible • Easy to assemble
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- | - | 0.95W/m.K | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MPC101020T
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SC14047 |
Heatsink, Ceramic 10x10x2mm, Standard Tape AMEC THERMASOL The MPC101020T is a 10x10x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...
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1+ £1.25 (£1.50) 10+ £0.73 (£0.88) 100+ £0.56 (£0.67) |
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- | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SP400-0.007-00-54
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SC09976 |
Thermal Pad, Sil-Pad, TO220, 10 Pack BERGQUIST The SP400-0.007-00-54 is a 19.05x12.7mm no adhesive original Sil-Pad® 400 Material which is composite of silicone rubber and fibreglass. The material is flame retardant and is specially formulated for use as a thermally conductive insulator. The primary us...
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Pack of 10
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1+ £5.04 (£6.05) 25+ £4.48 (£5.38) 50+ £4.04 (£4.85) |
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- | - | 0.9W/m.K | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GAP PAD 0.125" SHEET 100MMX100MM
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SC10740 |
Gap Pad, 0.125", 100mm x 100mm Sheet BERGQUIST Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...
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1+ £18.08 (£21.70) 5+ £14.89 (£17.87) |
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- | - | 0.8W/m.K | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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D-FARR-0044
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SC10733 |
Gap Pad, 2mm BERGQUIST Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...
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1+ £12.53 (£15.04) 5+ £10.44 (£12.53) |
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- | - | 0.8W/m.K | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BP100-0.005-00-6/6
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SC10753 |
Thermal Tape, Bond Ply 100, 150mm x 150mm BERGQUIST • Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB • Thermal impedance: 0.86℃ - in²/W (@ 100 psi) • High bond strength to a variety of surfaces • Double-sided pressure sensitive adhesive tape • High performance, ...
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1+ £13.72 (£16.46) 5+ £13.18 (£15.82) 10+ £12.84 (£15.41) |
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- | - | 0.8W/m.K | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MPC222225T
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SC14050 |
Heatsink, Ceramic 22x22x2.5mm, Standard Tape AMEC THERMASOL The MPC222225T is a 22x22x2.5mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...
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1+ £1.70 (£2.04) 10+ £1.00 (£1.20) 100+ £0.75 (£0.90) 250+ £0.71 (£0.85) |
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- | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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FCH25255T
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SC14059 |
Heatsink, 25mm x 25mm x 5mm, Ceramic AMEC THERMASOL The FCH micro porous ceramic finned heat sinks are constructed from entirely new material structure that moves heat by air circulation (without external force). Due to its micro-porous nature it provides a vast surface area compared with traditional heat s...
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1+ £1.13 (£1.36) 10+ £1.01 (£1.21) 100+ £0.89 (£1.07) 250+ £0.74 (£0.89) |
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- | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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FCH505010T
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SC14063 |
Heatsink, 50mm x 50mm x 10.25mm, Ceramic AMEC THERMASOL The FCH micro porous ceramic finned heat sinks are constructed from entirely new material structure that moves heat by air circulation (without external force). Due to its micro-porous nature it provides a vast surface area compared with traditional heat s...
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1+ £2.49 (£2.99) 10+ £2.21 (£2.65) 100+ £2.09 (£2.51) 250+ £1.93 (£2.32) |
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- | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2.2K3A1B
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SN36255 |
Thermistor, NTC BETATHERM The BetaCurve-1 series NTC Thermistor features thermally conductive epoxy coating choice of 4 temperature tolerance classifications. The BetaCURVE chip is soldered to 32 AWG Alloy 180 leads and encapsulated in Stycast epoxy resin. • 2.2 to 100kΩ @ 25°C Res...
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- | - | - | - | - | - | - | BetaCurve-1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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425 25MM
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SA04124 |
General Purpose Aluminium Foil Tape, 25mm x 55m 3M • Aluminium foil tape 425 comprised of a dead soft aluminium foil backing • Thermally conductive tape helps dissipate heat and improves heating and cooling efficiency • Resistant to chemicals to protect surfaces during de-paint process and chemical maskin...
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- | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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WLK 30
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SC10758 |
Adhesive, Thermal Conductive, 30g FISCHER ELEKTRONIK • Thermally conductive, electrically non-conductive adhesive • Two part epoxy resin adhesive, metaloxide filled • Fully replaces mechanical fastenings • Excellent function and application characteristics • Adhesive epoxy
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Activator / Hardener | - | 0.836W/m.K | - | Bottle | - | 30g | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GAP PAD 0.06" SHEET 100MMX100MM
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SC10735 |
Gap Pad, Non-Soft 0.06", 100mm x 100mm Sheet BERGQUIST Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...
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1+ £9.70 (£11.64) 5+ £7.54 (£9.05) |
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- | - | 0.8W/m.K | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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D-FAR-0045
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SC10739 |
Gap Pad, 4.1mm BERGQUIST Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...
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1+ £29.00 (£34.80) 5+ £25.00 (£30.00) 10+ £23.82 (£28.58) |
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- | - | 0.8W/m.K | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MPC303050WT
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SC14055 |
Heatsink, Ceramic 30x30x5mm, Standard Tape AMEC THERMASOL The MPC303050WT is a 30x30x5.0mm low-profile, light-weight, wave type Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore prov...
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1+ £2.11 (£2.53) 10+ £1.45 (£1.74) 100+ £1.02 (£1.22) |
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- | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MPC202025T
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SC14049 |
Heatsink, Ceramic 20x20x2.5mm, Standard Tape AMEC THERMASOL The MPC202025T is a 20x20x 2.5mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides ...
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1+ £1.55 (£1.86) 10+ £1.12 (£1.34) 100+ £0.83 (£1.00) 250+ £0.77 (£0.92) |
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L375-150-2.0A
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SC10702 |
Gap Filler, 2mm Sheet T GLOBAL • L37-5 grey colour thermal conductive pad • One or two sided thermally conductive adhesive for ease of manufacture • Very good thermal conductivity • Low thermal impedance and good compressibility • Hardness is 25 • Used on IC, CPU and MOS and connection...
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- | - | 1.6W/m.K | - | - | - | - | L375 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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100K6A1B
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SN36253 |
Thermistor, NTC BETATHERM The 100K6A1B is a 2-pin NTC Thermistor with thermally conductive epoxy coating. The BetaCURVE-1 series thermistor chip is soldered to 32AWG alloy 180 leads and encapsulated in Stycast epoxy resin. Suitable for temperature sensing, control and compensation,...
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- | - | - | - | - | - | - | BetaCurve-1 |