Thermally Conductive Adhesives

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Thermally Conductive Adhesives


Displaying products for Thermally Conductive Adhesives - from our range of leading brand manufacturers.

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  Manufacturer Part No Order Code Description / Manufacturer
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Adhesive Type Adhesive Colour Thermal Conductivity Tensile Strength Dispensing Method Volume Weight Product Range
 
 
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WLK 5
WLK 5 - Adhesive, Thermal Conductive, 5g

SC10757

Adhesive, Thermal Conductive, 5g

FISCHER ELEKTRONIK

Epoxy based 2 component adhesive. The main characteristics are its good heat conductivity, high dielectric strength, and an expansion coefficient suited to copper and aluminium. The thermally conductive adhesive binds porous and non-porous surfaces such as...

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Activator / Hardener - 0.822W/m.K - - - 5g -
MC002571
MC002571 - Epoxy Resin, Black 1kg

SA03679

Epoxy Resin, Black 1kg

MULTICOMP PRO

This is a two-part, general purpose epoxy resin formulated for potting and encapsulation of electronics. The cured resin system meets the UL94 V-0 flammability rating. The flame retardant technology leads to low toxicity fumes and low smoke emission. It co...

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1+ £23.22 (£27.86) 10+ £21.89 (£26.27)

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- - - - Packet - 1kg -
MC002569
MC002569 - Epoxy Resin, Black 50g

SA03675

Epoxy Resin, Black 50g

MULTICOMP PRO

• Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack

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1+ £8.10 (£9.72) 10+ £7.41 (£8.89)

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- - - - Packet - 50g -
MC002568
MC002568 - Epoxy Resin, Black 500g

SA03678

Epoxy Resin, Black 500g

MULTICOMP

• Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack

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1+ £12.80 (£15.36) 10+ £11.75 (£14.10)

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- - - - Packet - 500g -
MC002566
MC002566 - Epoxy Resin, Black 100g

SA03676

Epoxy Resin, Black 100g

MULTICOMP

• Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack

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1+ £8.28 (£9.94) 10+ £7.90 (£9.48)

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- - - - Packet - 100g -
MC002567
MC002567 - Epoxy Resin, Black 250g

SA03677

Epoxy Resin, Black 250g

MULTICOMP

• Black Epoxy Resin • Potting / Encapsulating Electronics • Flame Retardant • Thermally Conductive 0.85W/m.K • Ready to Mix Pack

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1+ £11.07 (£13.28) 10+ £9.92 (£11.90)

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- - - - Packet - 250g -
MPC151525T
MPC151525T - Heatsink, Ceramic 15x15x2.5mm, Standard Tape

SC14048

Heatsink, Ceramic 15x15x2.5mm, Standard Tape

AMEC THERMASOL

The MPC151525T is a 15x15x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...

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1+ £1.15 (£1.38) 10+ £0.94 (£1.13) 100+ £0.72 (£0.86) 250+ £0.62 (£0.74)

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LI-98-150-025
LI-98-150-025 - Thermal Tape, Adhesive, 150mm x 150mm

SC10691

Thermal Tape, Adhesive, 150mm x 150mm

T GLOBAL

A sheet of double sided adhesive designed for use with thermal gap fillers. • Good adhesion • Very good thermal conductivity • Highly compressible • Easy to assemble

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1+ £8.08 (£9.70) 25+ £6.91 (£8.29)

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- - 0.95W/m.K - - - - -
MPC101020T
MPC101020T - Heatsink, Ceramic 10x10x2mm,  Standard Tape

SC14047

Heatsink, Ceramic 10x10x2mm,  Standard Tape

AMEC THERMASOL

The MPC101020T is a 10x10x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...

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1+ £1.25 (£1.50) 10+ £0.73 (£0.88) 100+ £0.56 (£0.67)

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SP400-0.007-00-54
SP400-0.007-00-54 - Thermal Pad, Sil-Pad, TO220, 10 Pack

SC09976

Thermal Pad, Sil-Pad, TO220, 10 Pack

BERGQUIST

The SP400-0.007-00-54 is a 19.05x12.7mm no adhesive original Sil-Pad® 400 Material which is composite of silicone rubber and fibreglass. The material is flame retardant and is specially formulated for use as a thermally conductive insulator. The primary us...

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Pack of  10

1+ £5.04 (£6.05) 25+ £4.48 (£5.38) 50+ £4.04 (£4.85)

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- - 0.9W/m.K - - - - -
GAP PAD 0.125" SHEET 100MMX100MM
GAP PAD 0.125

SC10740

Gap Pad, 0.125", 100mm x 100mm Sheet

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...

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1+ £18.08 (£21.70) 5+ £14.89 (£17.87)

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- - 0.8W/m.K - - - - -
D-FARR-0044
D-FARR-0044 - Gap Pad, 2mm

SC10733

Gap Pad, 2mm

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...

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1+ £12.53 (£15.04) 5+ £10.44 (£12.53)

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- - 0.8W/m.K - - - - -
BP100-0.005-00-6/6
BP100-0.005-00-6/6 - Thermal Tape, Bond Ply 100, 150mm x 150mm

SC10753

Thermal Tape, Bond Ply 100, 150mm x 150mm

BERGQUIST

• Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB • Thermal impedance: 0.86℃ - in²/W (@ 100 psi) • High bond strength to a variety of surfaces • Double-sided pressure sensitive adhesive tape • High performance, ...

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1+ £13.72 (£16.46) 5+ £13.18 (£15.82) 10+ £12.84 (£15.41)

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- - 0.8W/m.K - - - - -
MPC222225T
MPC222225T - Heatsink, Ceramic 22x22x2.5mm, Standard Tape

SC14050

Heatsink, Ceramic 22x22x2.5mm, Standard Tape

AMEC THERMASOL

The MPC222225T is a 22x22x2.5mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...

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1+ £1.70 (£2.04) 10+ £1.00 (£1.20) 100+ £0.75 (£0.90) 250+ £0.71 (£0.85)

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FCH25255T
FCH25255T - Heatsink, 25mm x 25mm x 5mm, Ceramic

SC14059

Heatsink, 25mm x 25mm x 5mm, Ceramic

AMEC THERMASOL

The FCH micro porous ceramic finned heat sinks are constructed from entirely new material structure that moves heat by air circulation (without external force). Due to its micro-porous nature it provides a vast surface area compared with traditional heat s...

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1+ £1.13 (£1.36) 10+ £1.01 (£1.21) 100+ £0.89 (£1.07) 250+ £0.74 (£0.89)

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FCH505010T
FCH505010T - Heatsink, 50mm x 50mm x 10.25mm, Ceramic

SC14063

Heatsink, 50mm x 50mm x 10.25mm, Ceramic

AMEC THERMASOL

The FCH micro porous ceramic finned heat sinks are constructed from entirely new material structure that moves heat by air circulation (without external force). Due to its micro-porous nature it provides a vast surface area compared with traditional heat s...

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1+ £2.49 (£2.99) 10+ £2.21 (£2.65) 100+ £2.09 (£2.51) 250+ £1.93 (£2.32)

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2.2K3A1B
2.2K3A1B - Thermistor, NTC

SN36255

Thermistor, NTC

BETATHERM

The BetaCurve-1 series NTC Thermistor features thermally conductive epoxy coating choice of 4 temperature tolerance classifications. The BetaCURVE chip is soldered to 32 AWG Alloy 180 leads and encapsulated in Stycast epoxy resin. • 2.2 to 100kΩ @ 25°C Res...

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1+ £3.95 (£4.74) 25+ £3.33 (£4.00) 100+ £2.82 (£3.38)

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- - - - - - - BetaCurve-1
425 25MM
425 25MM - General Purpose Aluminium Foil Tape, 25mm x 55m

SA04124

General Purpose Aluminium Foil Tape, 25mm x 55m

3M

• Aluminium foil tape 425 comprised of a dead soft aluminium foil backing • Thermally conductive tape helps dissipate heat and improves heating and cooling efficiency • Resistant to chemicals to protect surfaces during de-paint process and chemical maskin...

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1+ £35.08 (£42.10) 5+ £33.49 (£40.19)

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WLK 30
WLK 30 - Adhesive, Thermal Conductive, 30g

SC10758

Adhesive, Thermal Conductive, 30g

FISCHER ELEKTRONIK

• Thermally conductive, electrically non-conductive adhesive • Two part epoxy resin adhesive, metaloxide filled • Fully replaces mechanical fastenings • Excellent function and application characteristics • Adhesive epoxy

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Activator / Hardener - 0.836W/m.K - Bottle - 30g -
GAP PAD 0.06" SHEET 100MMX100MM
GAP PAD 0.06

SC10735

Gap Pad, Non-Soft 0.06", 100mm x 100mm Sheet

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...

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1+ £9.70 (£11.64) 5+ £7.54 (£9.05)

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- - 0.8W/m.K - - - - -
D-FAR-0045
D-FAR-0045 - Gap Pad, 4.1mm

SC10739

Gap Pad, 4.1mm

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...

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1+ £29.00 (£34.80) 5+ £25.00 (£30.00) 10+ £23.82 (£28.58)

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- - 0.8W/m.K - - - - -
MPC303050WT
MPC303050WT - Heatsink, Ceramic 30x30x5mm, Standard Tape

SC14055

Heatsink, Ceramic 30x30x5mm, Standard Tape

AMEC THERMASOL

The MPC303050WT is a 30x30x5.0mm low-profile, light-weight, wave type Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore prov...

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MPC202025T
MPC202025T - Heatsink, Ceramic 20x20x2.5mm, Standard Tape

SC14049

Heatsink, Ceramic 20x20x2.5mm, Standard Tape

AMEC THERMASOL

The MPC202025T is a 20x20x 2.5mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides ...

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L375-150-2.0A
L375-150-2.0A - Gap Filler, 2mm Sheet

SC10702

Gap Filler, 2mm Sheet

T GLOBAL

• L37-5 grey colour thermal conductive pad • One or two sided thermally conductive adhesive for ease of manufacture • Very good thermal conductivity • Low thermal impedance and good compressibility • Hardness is 25 • Used on IC, CPU and MOS and connection...

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- - 1.6W/m.K - - - - L375
100K6A1B
100K6A1B - Thermistor, NTC

SN36253

Thermistor, NTC

BETATHERM

The 100K6A1B is a 2-pin NTC Thermistor with thermally conductive epoxy coating. The BetaCURVE-1 series thermistor chip is soldered to 32AWG alloy 180 leads and encapsulated in Stycast epoxy resin. Suitable for temperature sensing, control and compensation,...

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- - - - - - - BetaCurve-1