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No-Clean Lead-Free Low Temperature Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T3 Mesh, 50g -
SMDLTLFP50T3
- Manufacturer:
- CHIP QUIK CHIP QUIK
- Manufacturer Part No:
- SMDLTLFP50T3
- Order Code:
- SD02705
- Product Range
- -
- Technical Datasheet:
- SMDLTLFP50T3 Datasheet
Product Overview
- Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Alloy: Sn42/Bi57.6/Ag0.4
- Shelf life:
6 months (refrigerated), 2 months (unrefrigerated)
Product Information
- :
- Synthetic No Clean
- :
- 42, 57.6, 0.4 Sn, Bi, Ag
- :
- 138°C
- :
- 50g
- :
- 1.76oz
- :
- -
Technical Documents (2)
1 In stock
You can reserve stock now just order your desired quantity and checkout as normal. The quantity that cant be dispatched now will be placed on back order and sent as soon as we get a delivery from our supplier. You only get charged when the products are dispatched to you.
5 more will be available week commencing 29/06/25
Extra stock is available upon order to the Supplier Lead Time which is approximately 14/07/25
5 more will be available week commencing 29/06/25
Reserving future stockOrder before 6pm
Monday to Friday excluding National Holidays
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Pricing is unavailable. Please contact customer services.
- Price for:
- Each
- 1+
- 3+
| Quantity | Price | Your Price (Inc. VAT) |
|---|---|---|
| 1+ | £16.83 (£20.20) | ( ) |
| 3+ | £16.50 (£19.80) | ( ) |
| Quantity | Price | Your Price (Inc. VAT) |
|---|
Pricing is unavailable. Please contact customer services.