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Solder


Solder with confidence thanks to our huge variety of solders. Browse our selection of solder wire; solder paste; and solder bars from manufacturers you can trust. We offer traditional solder alloys, as well as lead-free solder and no-clean solder - so whatever you're looking for, you can be confident you'll find it here. If you need to know more, don't hesitate to call our sales team at 03447 880088 or email sales@cpc.co.uk. Shop our selection of solder products today!

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Leaded / Lead Free Flux Type Solder Alloy External Diameter - Metric
 
 
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SMDLTLFP
SMDLTLFP - No-Clean Lead-Free Low Temperature Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T5 Mesh, 5cc

SD01716

No-Clean Lead-Free Low Temperature Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T5 Mesh, 5cc

CHIP QUIK

No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip. • Low melting point allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wide proce...

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- No Clean 42, 57.6, 0.4 Sn, Bi, Ag -
SAC305 862 4 89%
SAC305 862 4 89% - Lead Free Solder Paste, 95.5/0.5/0.5, 250g Pot

SD02121

Lead Free Solder Paste, 95.5/0.5/0.5, 250g Pot

QUALITEK

• Lead-free Solder paste for printing • Popular lead-free alloy for SMT • No clean flux • Broad process window • Post Soldering residues are transparent, non-corrosive and non-conductive • MESH Type 3 • Handy 250g pot • Melting temperature: 217°C - 219°C

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- - 95.5, 3, 0.5 Sn, Ag, Cu -
D01685
D01685 - Lead Free Solder Wire, 0.7mm, 100g

SD01539

Lead Free Solder Wire, 0.7mm, 100g

DURATOOL

• High activity rosin flux • Complies with RoHS lead-free requirements

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Lead Free - 99.3, 0.7 Sn, Cu 0.7mm
SN62 818 4 90%, 250G TUB
SN62 818 4 90%, 250G TUB - 818 Low Residue No-Clean Solder Paste

SD01925

818 Low Residue No-Clean Solder Paste

QUALITEK

Low residue No-Clean solder paste designed for surface mount and other electronic assembly applications. The unique properties of this formula provides an excellent activity, long stencil life, long tack time, high print speed and a longer shelf life. Post...

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- - 62, 36, 2 Sn, Pb, Ag -
SMD291AX50T3
SMD291AX50T3 - No-Clean Solder Paste Jar, Sn63/Pb37, T3 Mesh, 50g

SD02699

No-Clean Solder Paste Jar, Sn63/Pb37, T3 Mesh, 50g

CHIP QUIK

No-clean solder paste in 50g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed print heads • P...

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- Synthetic No Clean 63, 37 Sn, Pb -
NEXUS NU-CLEAR, 0.315MM, 2M
NEXUS NU-CLEAR, 0.315MM, 2M - Nexus Nu-Clear No Clean Solder Wire, 0.315mm, 2m

SD02799

Nexus Nu-Clear No Clean Solder Wire, 0.315mm, 2m

WARTON

Nexus cored solder wire is formulated for no clean, lead-free, automated and hand soldering operations requiring fast wetting and defect-free soldering of even the most difficult to solder components and board PCB finishes. • No clean, clear minimal and no...

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Lead Free No Clean 96.5, 3, 0.5 Sn, Ag, Cu 0.315mm
MICROPRINT P2010 15-32UM, 250G
MICROPRINT P2010 15-32UM, 250G - Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 250g Pot

SD02808

Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 250g Pot

WARTON

Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...

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- No Clean 96.5, 3, 0.5 Sn, Ag, Cu -
NEXUS NU-CLEAR, 0.234MM, 2M
NEXUS NU-CLEAR, 0.234MM, 2M - Nexus Nu-Clear No Clean Solder Wire, 0.234mm, 2m

SD02797

Nexus Nu-Clear No Clean Solder Wire, 0.234mm, 2m

WARTON

Nexus cored solder wire is formulated for no clean, lead-free, automated and hand soldering operations requiring fast wetting and defect-free soldering of even the most difficult to solder components and board PCB finishes. • No clean, clear minimal and no...

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Lead Free No Clean 96.5, 3, 0.5 Sn, Ag, Cu 0.234mm
NEXUS NU-CLEAR, 0.274MM, 2M
NEXUS NU-CLEAR, 0.274MM, 2M - Nexus Nu-Clear No Clean Solder Wire, 0.274mm, 2m

SD02798

Nexus Nu-Clear No Clean Solder Wire, 0.274mm, 2m

WARTON

Nexus cored solder wire is formulated for no clean, lead-free, automated and hand soldering operations requiring fast wetting and defect-free soldering of even the most difficult to solder components and board PCB finishes. • No clean, clear minimal and no...

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Lead Free No Clean 96.5, 3, 0.5 Sn, Ag, Cu 0.274mm
MICROPRINT P2010, 25-45UM, 40G
MICROPRINT P2010, 25-45UM, 40G - Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 40g Syringe

SD02801

Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 40g Syringe

WARTON

Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...

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- No Clean 96.5, 3, 0.5 Sn, Ag, Cu -
D03349
D03349 - 60/40 Solder Wire, 1.2mm, 50g

SD02301

60/40 Solder Wire, 1.2mm, 50g

DURATOOL

• High activity rosin flux • Low melting point for rework and repair

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Leaded Rosin 60, 40 Sn, Pb 1.2mm
SMDIN52SN48
SMDIN52SN48 - Indium Solder Wire, 0.8mm, 3.05m

SD02711

Indium Solder Wire, 0.8mm, 3.05m

CHIP QUIK

Low temperature, Indium solder wire is excellent for soldering and sealing. • Solid core wire, no flux • Supplied with 2cc of SMD291 flux

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Lead Free - 52, 48 In, Sn 0.8mm
ACTIV8, 1.2MM, 100G
ACTIV8, 1.2MM, 100G - Activ8 Acid-Cored Solder Wire, 1.2mm, 100g

SD02793

Activ8 Acid-Cored Solder Wire, 1.2mm, 100g

WARTON

Acid-cored solder wire for use in metal fabrication. • Solders brass, bronze, cadmium plating, copper, galvanised wire, iron, lead, mild steel, nickel, resistance wires, silver, spring steel, stainless steels etc. • Can be used for a variety of uses but sh...

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Lead Free Acid 96.5, 3.5 Sn, Ag 1.20mm
SN62 619D 4 86%, 35G INC PLUNGER
SN62 619D 4 86%, 35G INC PLUNGER - DSP 619D No-Clean Solder Paste (Sn63/Pb37)

SD01924

DSP 619D No-Clean Solder Paste (Sn63/Pb37)

QUALITEK

No-clean solder paste designed for surface mount applications using a syringe dispensing method. • Transparent, soft, non-conductive, pin testable post solder residue • Excellent wettability • Supplied in a 10cc Syringe with plunger

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- No Clean 63, 37 Sn, Pb -
309 99C 5C 0.7MM H 500G
309 99C 5C 0.7MM H 500G - Lead Free Solder Wire, 0.7mm, 500g, 227°C

SD00971

Lead Free Solder Wire, 0.7mm, 500g, 227°C

MULTICORE / LOCTITE

The 3099075-M is a 0.7mm 99.3/0.7 grade Lead-free Solder Wire, made of Sn and Cu alloy. The cored wire is manufactured with a range of flux contents and although users will normally be using products with a nominal flux content of 3%. • Fast soldering • Pa...

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Lead Free Rosin 99.3, 0.7 Sn, Cu 0.7mm
D01682
D01682 - 60/40 Solder Wire, 0.7mm, 500g

SD01536

60/40 Solder Wire, 0.7mm, 500g

DURATOOL

• High activity rosin flux • Low melting point for rework and repair

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Leaded Rosin 60, 40 Sn, Pb 0.7mm
309 60EN 5C 0.7MM R 250G
309 60EN 5C 0.7MM R 250G - Solder Wire, 0.7mm, 250g, 180°C

SD00959

Solder Wire, 0.7mm, 250g, 180°C

MULTICORE / LOCTITE

The 3096725-M is a Rosin based cored Solder Wire flux with 0.028-inch external diameter. Multicore 309 solid flux is based on a blend of novel activators and resins and it has a mild characteristic odour and leaves a clear pale residue. • Fast soldering • ...

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Leaded Rosin 60, 40 Sn, Pb 0.7mm
SMD4300AX10
SMD4300AX10 - Solder Paste No Clean 63Sn/37Pb in 10cc Syringe 35g Water Washable (T3)

SD01438

Solder Paste No Clean 63Sn/37Pb in 10cc Syringe 35g Water Washable (T3)

CHIP QUIK

• Supplied in 10cc syringe • Water washable

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- No Clean 63, 37 Sn, Pb -
22SWG-FF
22SWG-FF - No-clean 2% FF Solder Wire (Sn 63; Pb 37) 22SWG 0.7mm 183°C

SD00074

No-clean 2% FF Solder Wire (Sn 63; Pb 37) 22SWG 0.7mm 183°C

WARTON

• No Clean, Low, Clear Residue • Efficient soldering on assembly work, re-work and post cleaning assembly • Halide Free • 2% Fast flow flux

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Leaded No Clean 63, 37 Sn, Pb 0.7mm
SAC305 618D 4 85%, 25G INC PLUNGER
SAC305 618D 4 85%, 25G INC PLUNGER - Lead Free No-Clean Solder Paste

SD01926

Lead Free No-Clean Solder Paste

QUALITEK

Lead free solder paste which exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues are non-conductive, non-corrosive and highly insulated. • Low residues • Easily dispensed • Long...

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- No Clean 95, 5, 0.7 Sn, Ag, Cu -
SMD291AX10
SMD291AX10 - No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 10cc

SD01437

No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 10cc

CHIP QUIK

No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...

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- No Clean 63, 37 Sn, Pb -
SMD291SNL60T4
SMD291SNL60T4 - Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4)

SD02053

Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4)

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix

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- No Clean 96.5, 3, 0.5 Sn, Ag, Cu -
SMDLTLFP60T4
SMDLTLFP60T4 - Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 60g (T4)

SD02051

Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 60g (T4)

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...

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- No Clean 42, 57.6, 0.4 Sn, Bi, Ag -
SMDLTLFP15T4
SMDLTLFP15T4 - Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 15g (T4)

SD02050

Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 15g (T4)

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...

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- No Clean 42, 57.6, 0.4 Sn, Bi, Ag -
SMDLTLFP50T3
SMDLTLFP50T3 - No-Clean Lead-Free Low Temperature Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T3 Mesh, 50g

SD02705

No-Clean Lead-Free Low Temperature Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T3 Mesh, 50g

CHIP QUIK

No-clean, lead-free, low temperature solder paste in 50g jar. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue...

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- Synthetic No Clean 42, 57.6, 0.4 Sn, Bi, Ag -