Solder
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Solder
Solder with confidence thanks to our huge variety of solders. Browse our selection of solder wire; solder paste; and solder bars from manufacturers you can trust. We offer traditional solder alloys, as well as lead-free solder and no-clean solder - so whatever you're looking for, you can be confident you'll find it here. If you need to know more, don't hesitate to call our sales team at 03447 880088 or email sales@cpc.co.uk. Shop our selection of solder products today!
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Manufacturer Part No | Order Code | Description / Manufacturer | Availability | Price For |
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Quantity | Leaded / Lead Free | Flux Type | Solder Alloy | External Diameter - Metric | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Sort Acending Sort Decending | Sort Acending Sort Decending | Sort Acending Sort Decending | Sort Acending Sort Decending | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SMDSG10CCR
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SD03512 |
Manual Syringe Gun, 10cc Syringe CHIP QUIK Manual syringe gun supplied with one 10cc syringe. • Includes syringe gun (with push rod and o-ring), syringe, piston, front and rear covers, conical plastic dispensing tip, straight stainless steel dispensing tip • Compatible with OEM CHIPQUIK syringes - ...
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SMDSWLT.040 200G
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SD03504 |
Low Temperature Flux Core Solder Wire, Sn42/Bi57/Ag1, 1mm, 200g CHIP QUIK Low-temperature, lead-free solder wire with 2.2% no-clean RA flux core. • Easier to use than leaded solder • Excellent flow, shiny joints • 2.2% no-clean, rosin-activated flux core • Halogen content: None
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1+ £155.00 (£186.00) |
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Lead Free | No Clean | 42, 57, 1 Sn, Bi, Ag | 1mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SMD3SWLT.040 200G
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SD03506 |
Low Temperature Flux Core Solder Wire, Sn42/Bi58, 1mm, 200g CHIP QUIK Low-temperature, lead-free solder wire with 2.2% no-clean RA flux core. • Easier to use than leaded solder • Excellent flow, shiny joints • 2.2% no-clean, rosin-activated flux core • Halogen content: None
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1+ £149.00 (£178.80) |
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Lead Free | No Clean | 42, 58 Sn, Bi | 1mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SS-METAL-PEN-B10
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SD03524 |
Stainless Steel Solder Paste Squeegee Pen, 10mm Blade PROTO ADVANTAGE Stainless steel solder paste squeegee pen, used to spread paste on to SMT footprint pads. • 0.2mm stainless steel, bends slightly to help apply even pressure to stencil • Reusable
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SS-METAL-PEN-BODY
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SD03528 |
Stainless Steel Solder Paste Squeegee Pen Body PROTO ADVANTAGE Stainless steel solder paste squeegee pen body, used with compatible squeegee blades to spread paste on to SMT footprint pads. • Extra/replacement squeegee pen body supplied with B20 squeegee • Designed to hold 0.2mm thick stainless steel squeegee blades, ...
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SS-METAL-PEN-B30
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SD03526 |
Stainless Steel Solder Paste Squeegee Pen, 30mm Blade PROTO ADVANTAGE Stainless steel solder paste squeegee pen, used to spread paste on to SMT footprint pads. • 0.2mm stainless steel, bends slightly to help apply even pressure to stencil • Reusable
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SS-METAL-PEN-B40
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SD03527 |
Stainless Steel Solder Paste Squeegee Pen, 40mm Blade PROTO ADVANTAGE Stainless steel solder paste squeegee pen, used to spread paste on to SMT footprint pads. • 0.2mm stainless steel, bends slightly to help apply even pressure to stencil • Reusable
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SMDIN100
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SD03518 |
Indium Solder Wire, In100, 0.8mm, 3.05m CHIP QUIK This pure indium solder wire bonds well to glass, ceramic, and quartz. • Can be used for low temperature soldering and for hermetic sealing • ChipQuik SMDIN100 (In100) products are suitable for cryogenic sealing applications • Pure indium in this product r...
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- | No Clean | 100 In | 0.8mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SS-METAL-0.2-68X36
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SD03521 |
Stainless Steel Solder Paste Squeegee, 68x36mm PROTO ADVANTAGE Stainless steel solder paste squeegee used to spread paste using our line of stainless steel stencils onto SMT footprint pads. • 0.2mm stainless steel, bends slightly to help apply even pressure to stencil • Reusable • Dimensions (WxHxD): 68x36x0.2mm
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SS-METAL-0.2-136X48
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SD03522 |
Stainless Steel Solder Paste Squeegee, 136x48mm PROTO ADVANTAGE Stainless steel solder paste squeegee used to spread paste using our line of stainless steel stencils onto SMT footprint pads. • 0.2mm stainless steel, bends slightly to help apply even pressure to stencil • Reusable • Dimensions (WxHxD): 136x48x0.2mm
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SS-METAL-PEN
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SD03523 |
Stainless Steel Solder Paste Squeegee Pen Kit & Replacement Blades PROTO ADVANTAGE Stainless steel solder paste squeegee pen kit, used to spread paste on to SMT footprint pads. • Includes four blade widths - 10mm, 20mm, 30mm, 40mm • 0.2mm stainless steel, bends slightly to help apply even pressure to stencil • Reusable
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D01681
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SD01535 |
60/40 Solder Wire, 0.7mm, 100g DURATOOL • High activity rosin flux • Low melting point for rework and repair
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Leaded | Rosin | 60, 40 Sn, Pb | 0.7mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 15-32UM, AUTO 40G
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SD02807 |
Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 40g Auto Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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1+ £18.69 (£22.43) 3+ £18.13 (£21.76) |
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- | No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 25-38UM, AUTO 40G
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SD02804 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-38um, 40g Auto Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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1+ £14.30 (£17.16) 3+ £13.20 (£15.84) |
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- | No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 25-38UM, 250G
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SD02805 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-38um, 250g Pot WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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1+ £44.53 (£53.44) 3+ £41.11 (£49.33) |
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- | No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 25-45UM, 250G
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SD02802 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 250g Pot WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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1+ £44.39 (£53.27) 3+ £40.98 (£49.18) |
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- | No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL10
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SD01439 |
No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T3 Mesh, 10cc CHIP QUIK No-clean, lead-free solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade...
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- | No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL60T4
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SD02053 |
Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix
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- | No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291AX
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SD02698 |
No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 5cc CHIP QUIK No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...
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- | Synthetic No Clean | 63, 37 Sn, Pb | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL50T3
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SD02703 |
No-Clean Lead-Free Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T3 Mesh, 50g CHIP QUIK No-clean, lead-free solder paste in 50g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed prin...
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- | Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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C 502 99C 5C 0.5MM G 250G
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SD00982 |
No-Clean Lead Free Clear Residue Cored Solder Wire 0.5mm, 250g MULTICORE / LOCTITE The 5029525-M is a 0.5mm 99.3/0.7 grade Lead-free Solder Wire, made of Sn and Cu alloy. The cored wire is manufactured with a range of flux contents and although users will normally be using products with a nominal flux content of 3%, the superior performa...
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Lead Free | Rosin | 99.3, 0.7 Sn, Cu | 0.5mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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362 99C 5C 0.7MM G 250G
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SD00520 |
Solder Cored Wire Flux, Lead Free, 22SWG, 0.7mm, 250g MULTICORE / LOCTITE • Contains five cores of Ersin 362 halide activated rosin flux
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Lead Free | - | 99.7, 0.3 Sn, Cu | 0.7mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DLMP22 500G REEL
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SD00065 |
Solder Cored Wire Flux, Low Melting Point, 0.7mm, 500g, 179°C MULTICORE / LOCTITE The alloys used for Multicore flux cored solder wire conforms to the purity requirements of the common national and international standards. Multicore 362 and 366 solid flux leave dry and non-sticky residues. In use its odour is typically that of rosin flu...
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Leaded | Rosin | 62, 36, 2 Sn, Pb, Ag | 0.71mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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FUTURE HF 2% 18SWG SAC30 0.25KG
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SD01847 |
No-clean Cored Solder Wire 1.2mm 217°C WARTON • Future wire is a clear residue, no clean cored solder wire • Activated formulation in 1% and 2% flux contents • Clear residue after soldering with no offensive odours generated during use • The solder wire is suitable for full assembly work, re-work and...
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Lead Free | - | 96.4, 2.8, 0.5, Sn, Ag, Cu | 1.2mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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RM 92 SN62AAS90 AK
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SD00042 |
RM92 No-Clean RMA Solder Cream for Stencilling 500g Tub MULTICORE / LOCTITE • Excellent tack life • High activity to deal with poor component solderablity • Produces safe residues – eliminates the need for cleaning • Supplied in a tub
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- | - | 62, 36, 2 Sn, Pb, Cu | - |