Solder Paste
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Solder Paste
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| Manufacturer Part No | Order Code | Description / Manufacturer | Availability | Price For |
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Quantity | Flux Type | Solder Alloy | Melting Temperature | Weight - Metric | Weight - Imperial | Product Range | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CR 88
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SD03035 |
Solder Paste, No-Clean, Lead-Free, Sn96.5/Ag3.5, 10g, 221C EDSYN The CR 88 from Edsyn is a solder paste. It is a predicted high-tech product with excellent suitability for all SMD application. CR88 solder paste is easy of application and user friendly for time saving soldering of SOP, QFP and PLCC packages. • Meets the ...
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No Clean | 96.5, 3.5 Sn, Ag | 221°C | 10g | 0.353oz | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SMDLTB35T4
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SD03585 |
Solder Paste, Synthetic No Clean, 170 °C Melting Temperature, 60, 40 Sn, Bi Alloy, 35g CHIP QUIK • Flux Type : Synthetic No Clean • Solder Alloy : 60, 40 Sn, Bi • Melting Temperature : 170°C • Weight - Metric : 35g • Weight - Imperial : 1.23oz
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Synthetic No Clean | 60, 40 Sn, Bi | 170°C | 35g | 1.23oz | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MICROPRINT P2010 15-32UM, 250G
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SD02808 |
Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 250g Pot WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 250g | 8.82oz | Warton Metals - Microprint P2010 Solder Paste | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MICROPRINT P2010 25-38UM, AUTO 40G
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SD02804 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-38um, 40g Auto Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SMD291AX50T3
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SD02699 |
No-Clean Solder Paste Jar, Sn63/Pb37, T3 Mesh, 50g CHIP QUIK No-clean solder paste in 50g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed print heads • P...
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Synthetic No Clean | 63, 37 Sn, Pb | 183°C | 50g | 1.76oz | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010, 25-45UM, 40G
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SD02801 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 40g Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 25-45UM, 250G
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SD02802 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 250g Pot WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 250g | 8.82oz | Warton Metals - Microprint P2010 Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 15-32UM, AUTO 40G
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SD02807 |
Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 40g Auto Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 25-38UM, 250G
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SD02805 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-38um, 250g Pot WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 250g | 8.82oz | Warton Metals - Microprint P2010 Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SN62 619D 4 86%, 35G INC PLUNGER
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SD01924 |
DSP 619D No-Clean Solder Paste (Sn63/Pb37) QUALITEK No-clean solder paste designed for surface mount applications using a syringe dispensing method. • Transparent, soft, non-conductive, pin testable post solder residue • Excellent wettability • Supplied in a 10cc Syringe with plunger
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No Clean | 63, 37 Sn, Pb | 183°C | 35g | 1.235oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD4300AX10
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SD01438 |
Solder Paste No Clean 63Sn/37Pb in 10cc Syringe 35g Water Washable (T3) CHIP QUIK • Supplied in 10cc syringe • Water washable
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No Clean | 63, 37 Sn, Pb | 183°C | 35g | 1.235oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291AX10
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SD01437 |
No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 10cc CHIP QUIK No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...
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No Clean | 63, 37 Sn, Pb | 183°C | 35g | 1.235oz | Chip Quik - No-Clean Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL60T4
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SD02053 |
Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 60g | 2.116oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291AX
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SD02698 |
No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 5cc CHIP QUIK No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...
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Synthetic No Clean | 63, 37 Sn, Pb | 183°C | 15g | 0.53oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP50T3
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SD02705 |
No-Clean Lead-Free Low Temperature Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T3 Mesh, 50g CHIP QUIK No-clean, lead-free, low temperature solder paste in 50g jar. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 50g | 1.76oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391LT
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SD02706 |
No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T4 Mesh, 5cc CHIP QUIK No-clean, lead-free, low temperature thermally stable solder paste in syringe applicator with plunger and tip. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 125mm/sec • Long s...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 15g | 0.53oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD4300SNL10
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SD01440 |
Solder Paste No Clean Lead-Free in 10cc Syringe 35g Water Washable (T3) CHIP QUIK • Supplied in 10cc syringe • Lead free • Water washable
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 35g | 1.235oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 15-32UM, 40G
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SD02806 |
Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 40g Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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F42240
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PC02161 |
No Clean Lead Free Solder Flux Paste for SMT, 10ml, 217°C CIF The F42240 is a no-clean Solder Paste or Cream is used for SMT soldering, it is made of an metal alloy and a flux which characteristics are similar to those used in wave soldering or hand soldering, the alloy is composed of rounded marbles (size from 20 to...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL
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SD02700 |
No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T3 Mesh, 5cc CHIP QUIK No-clean, lead-free solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade...
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Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 15g | 0.53oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391SNL
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SD02708 |
No-Clean, Lead-Free, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T4 Mesh, 5cc CHIP QUIK No-clean, lead-free, thermally stable solder paste in syringe applicator with plunger and tip. • Printing speeds up to 125mm/sec. • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finish...
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Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 15g | 0.53oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CR 77
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SD03037 |
Solder Paste, No-Clean, Lead-Free, Sn96.5/Ag3.5, 10g, 217C EDSYN CR77 is a lead-free solder paste for all SMD applications. • Lead-free, no-clean paste • Superior definition • Easy soldering of lead-free soldering joints in comparison to lead-free soldering wire • No globule or spatter formation • Long storage and usefu...
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No Clean | 96.5, 0.5 Sn, Ag, Cu | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391SNL10
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SD03588 |
Thermally Stable No Clean Solder Paste, Sn42/Ag3/Cu0.5, 35g CHIP QUIK Thermally stable, no-clean solder paste, lead-free in 10cc syringe with plunger and tip. • Revolutionary formula - no refrigeration required • Printing speeds up to 125mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excelle...
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Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 35g | 1.23oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391LT10
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SD03587 |
Thermally Stable No Clean Solder Paste, Sn42/Bi57.6/Ag0.4, 35g CHIP QUIK Thermally stable, no-clean solder paste, lead-free in 10cc syringe with plunger and tip. • Revolutionary formula - no refrigeration required • Printing speeds up to 125mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excelle...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 35g | 1.23oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||



























