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Solder Paste


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SAC305 862 4 89%
SAC305 862 4 89% - Lead Free Solder Paste, 95.5/0.5/0.5, 250g Pot

SD02121

Lead Free Solder Paste, 95.5/0.5/0.5, 250g Pot

QUALITEK

• Lead-free Solder paste for printing • Popular lead-free alloy for SMT • No clean flux • Broad process window • Post Soldering residues are transparent, non-corrosive and non-conductive • MESH Type 3 • Handy 250g pot • Melting temperature: 217°C - 219°C

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- 95.5, 3, 0.5 Sn, Ag, Cu 217°C 250g 0.55lb -
SN62 818 4 90%, 250G TUB
SN62 818 4 90%, 250G TUB - 818 Low Residue No-Clean Solder Paste

SD01925

818 Low Residue No-Clean Solder Paste

QUALITEK

Low residue No-Clean solder paste designed for surface mount and other electronic assembly applications. The unique properties of this formula provides an excellent activity, long stencil life, long tack time, high print speed and a longer shelf life. Post...

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- 62, 36, 2 Sn, Pb, Ag 125°C 250g 8.818oz -
SMD291AX50T3
SMD291AX50T3 - No-Clean Solder Paste Jar, Sn63/Pb37, T3 Mesh, 50g

SD02699

No-Clean Solder Paste Jar, Sn63/Pb37, T3 Mesh, 50g

CHIP QUIK

No-clean solder paste in 50g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed print heads • P...

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Synthetic No Clean 63, 37 Sn, Pb 183°C 50g 1.76oz -
MICROPRINT P2010, 25-45UM, 40G
MICROPRINT P2010, 25-45UM, 40G - Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 40g Syringe

SD02801

Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 40g Syringe

WARTON

Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 40g 1.41oz Warton Metals - Microprint P2010 Solder Paste
MICROPRINT P2010 15-32UM, 250G
MICROPRINT P2010 15-32UM, 250G - Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 250g Pot

SD02808

Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 250g Pot

WARTON

Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 250g 8.82oz Warton Metals - Microprint P2010 Solder Paste
SAC305 618D 4 85%, 25G INC PLUNGER
SAC305 618D 4 85%, 25G INC PLUNGER - Lead Free No-Clean Solder Paste

SD01926

Lead Free No-Clean Solder Paste

QUALITEK

Lead free solder paste which exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues are non-conductive, non-corrosive and highly insulated. • Low residues • Easily dispensed • Long...

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No Clean 95, 5, 0.7 Sn, Ag, Cu 217°C 25g 0.882oz -
SN62 619D 4 86%, 35G INC PLUNGER
SN62 619D 4 86%, 35G INC PLUNGER - DSP 619D No-Clean Solder Paste (Sn63/Pb37)

SD01924

DSP 619D No-Clean Solder Paste (Sn63/Pb37)

QUALITEK

No-clean solder paste designed for surface mount applications using a syringe dispensing method. • Transparent, soft, non-conductive, pin testable post solder residue • Excellent wettability • Supplied in a 10cc Syringe with plunger

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No Clean 63, 37 Sn, Pb 183°C 35g 1.235oz -
SMD291SNL10
SMD291SNL10 - No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T3 Mesh, 10cc

SD01439

No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T3 Mesh, 10cc

CHIP QUIK

No-clean, lead-free solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade...

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 217°C 35g 1.23oz Chip Quik - No-Clean Solder Paste
SMD291AX10
SMD291AX10 - No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 10cc

SD01437

No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 10cc

CHIP QUIK

No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...

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No Clean 63, 37 Sn, Pb 183°C 35g 1.235oz Chip Quik - No-Clean Solder Paste
SMD291SNL60T4
SMD291SNL60T4 - Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4)

SD02053

Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4)

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 217°C 60g 2.116oz -
SMDLTLFP15T4
SMDLTLFP15T4 - Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 15g (T4)

SD02050

Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 15g (T4)

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...

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No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 15g 0.529oz -
SMDLTLFP60T4
SMDLTLFP60T4 - Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 60g (T4)

SD02051

Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 60g (T4)

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...

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No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 60g 2.116oz -
SMD291AX
SMD291AX - No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 5cc

SD02698

No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 5cc

CHIP QUIK

No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...

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Synthetic No Clean 63, 37 Sn, Pb 183°C 15g 0.53oz -
SMDLTLFP50T3
SMDLTLFP50T3 - No-Clean Lead-Free Low Temperature Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T3 Mesh, 50g

SD02705

No-Clean Lead-Free Low Temperature Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T3 Mesh, 50g

CHIP QUIK

No-clean, lead-free, low temperature solder paste in 50g jar. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue...

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Synthetic No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 50g 1.76oz -
D01851
D01851 - Solder Flux Paste - 30g

SD01704

Solder Flux Paste - 30g

DURATOOL

• 80% Petroleum Jelly / 20% ZnCl<sub>2</sub>

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- - 48°C 30g 1.058oz D0185x
GC 10 SAC305T3 885V 52K 500G
GC 10 SAC305T3 885V 52K 500G - GC 10 No-Clean, Halogen-Free Solder Paste, T3 Powder, 500g

SD02341

GC 10 No-Clean, Halogen-Free Solder Paste, T3 Powder, 500g

LOCTITE

The LOCTITE GC10 SAC305T3 885V 52K is a halogen-free/no-clean/low Voiding/Pb-free Solder Paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel for...

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 217°C 500g 1.102lb -
TS391LT
TS391LT - No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T4 Mesh, 5cc

SD02706

No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T4 Mesh, 5cc

CHIP QUIK

No-clean, lead-free, low temperature thermally stable solder paste in syringe applicator with plunger and tip. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 125mm/sec • Long s...

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Synthetic No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 15g 0.53oz -
D01850
D01850 - Solder Flux Paste - 10g

SD01703

Solder Flux Paste - 10g

DURATOOL

• 80% Petroleum Jelly / 20% ZnCl<sub>2</sub>

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1+ £0.95 (£1.14) 10+ £0.85 (£1.02)

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- - 48°C 10g 0.353oz D0185x
SMD291SNL15T4
SMD291SNL15T4 - Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 15g (T4)

SD02052

Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 15g (T4)

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 217°C 15g 0.529oz -
SMD291SNL10T5
SMD291SNL10T5 - No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T5 Mesh, 10cc

SD02701

No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T5 Mesh, 10cc

CHIP QUIK

No-clean, lead-free solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade...

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Synthetic No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 35g 1.23oz -
TS391SNL50
TS391SNL50 - No-Clean, Lead-Free, Thermally Stable Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T4 Mesh, 50g

SD02709

No-Clean, Lead-Free, Thermally Stable Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T4 Mesh, 50g

CHIP QUIK

No-clean, lead-free, thermally stable solder paste in 50g jar. • Printing speeds up to 125mm/sec. • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible...

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Synthetic No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 50g 1.76oz -
TS391LT50
TS391LT50 - No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T4 Mesh, 50g

SD02707

No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T4 Mesh, 50g

CHIP QUIK

No-clean, lead-free, low temperature thermally stable solder paste in 50g jar. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 125mm/sec • Long stencil life • Wide process windo...

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Synthetic No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 50g 1.76oz -
NEXUS NXG-909 SMALL REWORK PACK
NEXUS NXG-909 SMALL REWORK PACK - Nexus Rework Gel, 10g

SD02787

Nexus Rework Gel, 10g

WARTON

Halide-free and halogen-free, clear residue rework gel for the rework of SMT and conventional through-hole devices. • Developed for excellent performance on all lead-free finishes • Exceeds the requirements of J-STD-004B type ROL0 • Powerful wetting on all...

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Halogen Free - - 10g 0.35oz Warton Metals - Nexus Rework Gel
GC 10 SAC305T4 885V 52K 500G
GC 10 SAC305T4 885V 52K 500G - GC 10 No-Clean, Halogen-Free Solder Paste, T4 Powder, 500g

SD02339

GC 10 No-Clean, Halogen-Free Solder Paste, T4 Powder, 500g

LOCTITE

GC 10 SAC305T4 885V 52K 500G is a Pb-free solder paste specially formulated to provide added long term stability over a range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field applic...

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1+ £83.78 (£100.54) 3+ £81.43 (£97.72)

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No Clean - 217°C 500g 1.102lb -
TS391SNL
TS391SNL - No-Clean, Lead-Free, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T4 Mesh, 5cc

SD02708

No-Clean, Lead-Free, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T4 Mesh, 5cc

CHIP QUIK

No-clean, lead-free, thermally stable solder paste in syringe applicator with plunger and tip. • Printing speeds up to 125mm/sec. • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finish...

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Synthetic No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 15g 0.53oz -