Solder Paste
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Solder Paste
Displaying products for Solder Paste - from our range of leading brand manufacturers.
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Manufacturer Part No | Order Code | Description / Manufacturer | Availability | Price For |
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Quantity | Flux Type | Solder Alloy | Melting Temperature | Weight - Metric | Weight - Imperial | Product Range | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP
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SD01716 |
No-Clean Lead-Free Low Temperature Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T5 Mesh, 5cc CHIP QUIK No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip. • Low melting point allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wide proce...
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No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | - | 15g | 0.529oz | Chip Quik - No-Clean Solder Paste | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SAC305 862 4 89%
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SD02121 |
Lead Free Solder Paste, 95.5/0.5/0.5, 250g Pot QUALITEK • Lead-free Solder paste for printing • Popular lead-free alloy for SMT • No clean flux • Broad process window • Post Soldering residues are transparent, non-corrosive and non-conductive • MESH Type 3 • Handy 250g pot • Melting temperature: 217°C - 219°C
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- | 95.5, 3, 0.5 Sn, Ag, Cu | 217°C | 250g | 0.55lb | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SN62 818 4 90%, 250G TUB
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SD01925 |
818 Low Residue No-Clean Solder Paste QUALITEK Low residue No-Clean solder paste designed for surface mount and other electronic assembly applications. The unique properties of this formula provides an excellent activity, long stencil life, long tack time, high print speed and a longer shelf life. Post...
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- | 62, 36, 2 Sn, Pb, Ag | 125°C | 250g | 8.818oz | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SMD291AX50T3
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SD02699 |
No-Clean Solder Paste Jar, Sn63/Pb37, T3 Mesh, 50g CHIP QUIK No-clean solder paste in 50g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed print heads • P...
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1+ £10.70 (£12.84) 3+ £10.39 (£12.47) |
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Synthetic No Clean | 63, 37 Sn, Pb | 183°C | 50g | 1.76oz | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MICROPRINT P2010 15-32UM, 250G
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SD02808 |
Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 250g Pot WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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1+ £53.53 (£64.24) 3+ £49.42 (£59.30) |
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 250g | 8.82oz | Warton Metals - Microprint P2010 Solder Paste | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010, 25-45UM, 40G
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SD02801 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 40g Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SN62 619D 4 86%, 35G INC PLUNGER
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SD01924 |
DSP 619D No-Clean Solder Paste (Sn63/Pb37) QUALITEK No-clean solder paste designed for surface mount applications using a syringe dispensing method. • Transparent, soft, non-conductive, pin testable post solder residue • Excellent wettability • Supplied in a 10cc Syringe with plunger
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No Clean | 63, 37 Sn, Pb | 183°C | 35g | 1.235oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD4300AX10
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SD01438 |
Solder Paste No Clean 63Sn/37Pb in 10cc Syringe 35g Water Washable (T3) CHIP QUIK • Supplied in 10cc syringe • Water washable
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No Clean | 63, 37 Sn, Pb | 183°C | 35g | 1.235oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SAC305 618D 4 85%, 25G INC PLUNGER
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SD01926 |
Lead Free No-Clean Solder Paste QUALITEK Lead free solder paste which exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues are non-conductive, non-corrosive and highly insulated. • Low residues • Easily dispensed • Long...
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1+ £17.90 (£21.48) 5+ £16.17 (£19.40) |
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No Clean | 95, 5, 0.7 Sn, Ag, Cu | 217°C | 25g | 0.882oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291AX10
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SD01437 |
No-Clean Solder Paste Syringe with Plunger & Tip, Sn63/Pb37, T3 Mesh, 10cc CHIP QUIK No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...
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1+ £16.33 (£19.60) 3+ £15.72 (£18.86) |
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No Clean | 63, 37 Sn, Pb | 183°C | 35g | 1.235oz | Chip Quik - No-Clean Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL60T4
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SD02053 |
Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 60g | 2.116oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP60T4
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SD02051 |
Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 60g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...
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No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 60g | 2.116oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP15T4
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SD02050 |
Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 15g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...
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No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 15g | 0.529oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP50T3
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SD02705 |
No-Clean Lead-Free Low Temperature Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T3 Mesh, 50g CHIP QUIK No-clean, lead-free, low temperature solder paste in 50g jar. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 50g | 1.76oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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D01851
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SD01704 |
Solder Flux Paste - 30g DURATOOL • 80% Petroleum Jelly / 20% ZnCl<sub>2</sub>
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- | - | 48°C | 30g | 1.058oz | D0185x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391LT
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SD02706 |
No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T4 Mesh, 5cc CHIP QUIK No-clean, lead-free, low temperature thermally stable solder paste in syringe applicator with plunger and tip. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 125mm/sec • Long s...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 15g | 0.53oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GC 10 SAC305T3 885V 52K 500G
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SD02341 |
GC 10 No-Clean, Halogen-Free Solder Paste, T3 Powder, 500g LOCTITE The LOCTITE GC10 SAC305T3 885V 52K is a halogen-free/no-clean/low Voiding/Pb-free Solder Paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel for...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 500g | 1.102lb | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD16
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SD00633 |
SMD Removal Alloy, 16ft, Leaded CHIP QUIK Replacement alloy for removing SMDs • The same alloy included with the Chip Quick Removal Kit • Instructions included
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- | 12, 18, 49, 21, Sn, Pb, Bi, In | 58°C | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD4300SNL10
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SD01440 |
Solder Paste No Clean Lead-Free in 10cc Syringe 35g Water Washable (T3) CHIP QUIK • Supplied in 10cc syringe • Lead free • Water washable
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 35g | 1.235oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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D01850
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SD01703 |
Solder Flux Paste - 10g DURATOOL • 80% Petroleum Jelly / 20% ZnCl<sub>2</sub>
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- | - | 48°C | 10g | 0.353oz | D0185x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL15T4
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SD02052 |
Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 15g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 15g | 0.529oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL10T5
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SD02701 |
No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T5 Mesh, 10cc CHIP QUIK No-clean, lead-free solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade...
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Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 35g | 1.23oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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698840
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SD02675 |
LF318 Solder Paste, 500g MULTICORE / LOCTITE • Lead free, Halide free solder paste • No clean residues • 88.5% metal content • Suitable for reflow in air or nitrogen • 96SC (SAC 387) 95.5% Tin, 3.8% Silver, 0.7% Copper • Melting point 217 °C
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- | 95.5, 3.8, 0.7 Sn, Ag, Cu | 217°C | 500g | 1.102lb | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391LT50
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SD02707 |
No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T4 Mesh, 50g CHIP QUIK No-clean, lead-free, low temperature thermally stable solder paste in 50g jar. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 125mm/sec • Long stencil life • Wide process windo...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 50g | 1.76oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 25-38UM, 40G
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SD02803 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-38um, 40g Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste |