Solder Paste
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Solder Paste
Displaying products for Solder Paste - from our range of leading brand manufacturers.
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| Manufacturer Part No | Order Code | Description / Manufacturer | Availability | Price For |
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Quantity | Flux Type | Solder Alloy | Melting Temperature | Weight - Metric | Weight - Imperial | Product Range | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP
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SD01716 |
No-Clean Lead-Free Low Temperature Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T5 Mesh, 5cc CHIP QUIK No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip. • Low melting point allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wide proce...
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No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 15g | 0.529oz | Chip Quik - No-Clean Solder Paste | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SAC305 862 4 89%
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SD02121 |
Lead Free Solder Paste, 95.5/0.5/0.5, 250g Pot QUALITEK • Lead-free Solder paste for printing • Popular lead-free alloy for SMT • No clean flux • Broad process window • Post Soldering residues are transparent, non-corrosive and non-conductive • MESH Type 3 • Handy 250g pot • Melting temperature: 217°C - 219°C
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- | 95.5, 3, 0.5 Sn, Ag, Cu | 217°C | 250g | 0.55lb | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SN62 818 4 90%, 250G TUB
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SD01925 |
818 Low Residue No-Clean Solder Paste QUALITEK Low residue No-Clean solder paste designed for surface mount and other electronic assembly applications. The unique properties of this formula provides an excellent activity, long stencil life, long tack time, high print speed and a longer shelf life. Post...
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- | 62, 36, 2 Sn, Pb, Ag | 125°C | 250g | 8.818oz | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MICROPRINT P2010 15-32UM, 250G
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SD02808 |
Microprint P2010 No Clean, Lead Free Solder Paste, 15-32um, 250g Pot WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 250g | 8.82oz | Warton Metals - Microprint P2010 Solder Paste | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MICROPRINT P2010, 25-45UM, 40G
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SD02801 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-45um, 40g Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SAC305 618D 4 85%, 25G INC PLUNGER
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SD01926 |
Lead Free No-Clean Solder Paste QUALITEK Lead free solder paste which exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues are non-conductive, non-corrosive and highly insulated. • Low residues • Easily dispensed • Long...
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No Clean | 95, 5, 0.7 Sn, Ag, Cu | 217°C | 25g | 0.882oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SN62 619D 4 86%, 35G INC PLUNGER
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SD01924 |
DSP 619D No-Clean Solder Paste (Sn63/Pb37) QUALITEK No-clean solder paste designed for surface mount applications using a syringe dispensing method. • Transparent, soft, non-conductive, pin testable post solder residue • Excellent wettability • Supplied in a 10cc Syringe with plunger
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No Clean | 63, 37 Sn, Pb | 183°C | 35g | 1.235oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL60T4
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SD02053 |
Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 60g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 60g | 2.116oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP15T4
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SD02050 |
Solder Paste No Clean Sn42/Bi57.6/Ag0.4 2-Part Mix 15g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...
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No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 15g | 0.529oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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D01851
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SD01704 |
Solder Flux Paste - 30g DURATOOL D01851 is 30g soldering flux paste. • 48°C melting temperature
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- | - | 48°C | 30g | 1.058oz | D0185x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GC 10 SAC305T3 885V 52K 500G
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SD02341 |
GC 10 No-Clean, Halogen-Free Solder Paste, T3 Powder, 500g LOCTITE The LOCTITE GC10 SAC305T3 885V 52K is a halogen-free/no-clean/low Voiding/Pb-free Solder Paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel for...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 500g | 1.102lb | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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RM 92 SN62AAS90 AK
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SD00042 |
RM92 No-Clean RMA Solder Cream for Stencilling 500g Tub MULTICORE / LOCTITE • Excellent tack life • High activity to deal with poor component solderablity • Produces safe residues – eliminates the need for cleaning • Supplied in a tub
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- | 62, 36, 2 Sn, Pb, Cu | - | 500g | 1.102lb | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD16
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SD00633 |
SMD Removal Alloy, 16ft, Leaded CHIP QUIK Replacement alloy for removing SMDs • The same alloy included with the Chip Quick Removal Kit • Instructions included
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- | 12, 18, 49, 21, Sn, Pb, Bi, In | 58°C | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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D01850
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SD01703 |
Solder Flux Paste - 10g DURATOOL • 80% Petroleum Jelly / 20% ZnCl<sub>2</sub>
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- | - | 48°C | 10g | 0.353oz | D0185x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL15T4
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SD02052 |
Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 15g (T4) CHIP QUIK • No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 217°C | 15g | 0.529oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL10T5
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SD02701 |
No-Clean Lead-Free Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T5 Mesh, 10cc CHIP QUIK No-clean, lead-free solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade...
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Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 35g | 1.23oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391LT50
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SD02707 |
No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T4 Mesh, 50g CHIP QUIK No-clean, lead-free, low temperature thermally stable solder paste in 50g jar. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 125mm/sec • Long stencil life • Wide process windo...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 50g | 1.76oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MICROPRINT P2010 25-38UM, 40G
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SD02803 |
Microprint P2010 No Clean, Lead Free Solder Paste, 25-38um, 40g Syringe WARTON Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...
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No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 40g | 1.41oz | Warton Metals - Microprint P2010 Solder Paste | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391SNL
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SD02708 |
No-Clean, Lead-Free, Thermally Stable Solder Paste Syringe with Plunger & Tip, Sn96.5/Ag3/Cu0.5, T4 Mesh, 5cc CHIP QUIK No-clean, lead-free, thermally stable solder paste in syringe applicator with plunger and tip. • Printing speeds up to 125mm/sec. • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finish...
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Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 15g | 0.53oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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NEXUS NXG-909 SMALL REWORK PACK
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SD02787 |
Nexus Rework Gel, 10g WARTON Halide-free and halogen-free, clear residue rework gel for the rework of SMT and conventional through-hole devices. • Developed for excellent performance on all lead-free finishes • Exceeds the requirements of J-STD-004B type ROL0 • Powerful wetting on all...
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Halogen Free | - | - | 10g | 0.35oz | Warton Metals - Nexus Rework Gel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMD291SNL250T3
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SD02702 |
No-Clean Lead-Free Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T3 Mesh, 250g CHIP QUIK No-clean, lead-free solder paste in 250g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed pri...
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Synthetic No Clean | 96.5, 3, 0.5 Sn, Ag, Cu | 220°C | 250g | 8.82oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMDLTLFP10T5
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SD02704 |
No-Clean Lead-Free Low Temperature Solder Paste Syringe with Plunger & Tip, Sn42/Bi57.6/Ag0.4, T5 Mesh, 10cc CHIP QUIK No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wid...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 35g | 1.23oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CR11
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SD03036 |
Solder Paste, No-Clean, Lead-Free, Sn42/Bi58, 10g, 138C EDSYN CR 11 is a lead free solder paste for all SMD applications. Not to be mixed with leaded material • Lead-free no clean Paste • Easy soldering of lead-free soldering joints when compared to lead-free soldering wire • No globule or spatter formation • Excelle...
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No Clean | 58, 42 Bi, Sn | 138°C | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CR 88
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SD03035 |
Solder Paste, No-Clean, Lead-Free, Sn96.5/Ag3.5, 10g, 221C EDSYN The CR 88 from Edsyn is a solder paste. It is a predicted high-tech product with excellent suitability for all SMD application. CR88 solder paste is easy of application and user friendly for time saving soldering of SOP, QFP and PLCC packages. • Meets the ...
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No Clean | 96.5, 3.5 Sn, Ag | 221°C | 10g | 0.353oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TS391LT10
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SD03587 |
Thermally Stable No Clean Solder Paste, Sn42/Bi57.6/Ag0.4, 35g CHIP QUIK Thermally stable, no-clean solder paste, lead-free in 10cc syringe with plunger and tip. • Revolutionary formula - no refrigeration required • Printing speeds up to 125mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excelle...
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Synthetic No Clean | 42, 57.6, 0.4 Sn, Bi, Ag | 138°C | 35g | 1.23oz | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||


























